1SG250HH1F55E2VG

The 1SG250HH1F55E2VG is a Stratix® 10 GX field programmable gate array (FPGA) in a 2912‑BBGA FCBGA package. It delivers high logic capacity, large on‑chip RAM, and a high I/O count for demanding, high‑performance applications.

As a member of the Intel Stratix 10 GX family, this device benefits from the family’s architectural innovations—such as the Intel Hyperflex core architecture and Intel 14 nm FinFET technology—targeting advanced applications where bandwidth, processing performance, and integration are critical.

Key Features

• Logic Capacity — 2,500,000 logic elements, providing substantial programmable fabric for complex designs.
• On‑chip Memory — 204,472,320 total RAM bits for large buffering, data staging, and embedded memory needs.
• I/O Density — 1,160 user I/O pins to support dense external connectivity and multi‑lane interfaces.
• Core Architecture — Built on the Intel Hyperflex core architecture (Stratix 10 family innovation) for improved core performance.
• Transceiver & System IP (Family Capabilities) — Stratix 10 GX family features include high‑speed transceivers and hard IP such as PCIe and 10G Ethernet (see family documentation for details applicable to this device).
• Package — 2912‑BBGA, FCBGA (supplier device package listed as 2912‑FBGA, FC (55×55)) for surface‑mount board integration.
• Power — Voltage supply range: 770 mV to 970 mV (core supply range as specified).
• Temperature & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C.
• Mounting — Surface mount device suitable for standard PCB assembly processes.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑performance networking and switches — High logic capacity, large on‑chip RAM, and dense I/O support multi‑lane packet processing and custom protocol implementations.
• Data center acceleration — Substantial programmable fabric and memory enable custom accelerators and data path offloads for compute and storage subsystems.
• Telecommunications and backplane systems — Family transceiver capabilities and the device’s I/O density support high‑bandwidth serial links and backplane interfaces.
• Signal processing and DSP-heavy workloads — Large RAM and logic resources allow implementation of complex DSP pipelines and dataflow architectures.

Unique Advantages

• High programmable capacity: 2,500,000 logic elements enable large, complex designs without immediate migration to higher‑end family members.
• Massive on‑chip memory: Over 204 million bits of RAM for deep buffering, lookup tables, and block memory implementations.
• Extensive I/O: 1,160 I/O pins simplify system integration and support multiple parallel interfaces or high‑lane counts.
• Family‑level architectural benefits: Leverages Stratix 10 GX innovations (Intel Hyperflex core architecture and 14 nm FinFET technology) to address demanding performance and power targets.
• Compact package with high pin count: 2912‑BBGA FCBGA (55×55) package balances footprint and connectivity for board‑level designs.
• Compliance and assembly readiness: Surface mount package and RoHS compliance facilitate integration into modern manufacturing flows.

Why Choose 1SG250HH1F55E2VG?

The 1SG250HH1F55E2VG positions itself as a high‑capacity Stratix 10 GX FPGA option for applications requiring substantial programmable fabric, large embedded memory, and a high number of I/O. Its Extended grade and specified operating range make it suitable for demanding commercial and communications environments where these attributes matter.

As part of the Intel Stratix 10 GX family, the device benefits from family innovations such as the Intel Hyperflex core architecture and supporting system IP documented for the series, providing a clear upgrade path and compatibility within the Stratix 10 ecosystem.

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