1SG211HN3F43I3VG

The 1SG211HN3F43I3VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA (FCBGA) package. This device implements Intel’s Stratix 10 GX architecture and leverages series-level innovations including the Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) process.

Designed for high‑performance, industrial applications, the device provides a large logic fabric and on‑chip memory together with high I/O density to support demanding communications, compute acceleration, and system integration tasks while operating over an industrial temperature range.

Key Features

• Core architecture  Intel Stratix 10 Hyperflex core architecture and Intel 14 nm tri‑gate technology as described in the Stratix 10 GX device overview.
• Logic resources  Approximately 2,110,000 logic elements to implement large custom logic and control functions.
• Embedded memory  140,509,184 total RAM bits for on‑chip buffering, state storage, and memory‑intensive functions.
• High I/O count  688 I/O pins to support dense external connectivity and multiple parallel interfaces.
• Package and mounting  1760‑BBGA (FCBGA), supplier package 1760‑FBGA (42.5 × 42.5 mm), surface mount.
• Power supply  Core voltage supply range 770 mV to 970 mV.
• Operating temperature  Industrial grade: −40 °C to 100 °C.
• System‑level IP and interfaces  Series‑level features described in the device overview include hard PCI Express Gen3 IP, DDR4 memory controller support, 10G Ethernet hard IP, high‑speed transceiver tiles, variable precision DSP blocks, and an embedded hard processor system in SoC variants.
• Regulatory status  RoHS compliant.

Typical Applications

• High‑speed networking and switching  High I/O count and Stratix 10 transceiver/ethernet IP support demanding packet processing, line cards, and switch fabrics.
• Data center acceleration  Large logic capacity and on‑chip memory make the device suitable for hardware acceleration and custom compute kernels.
• Telecommunications infrastructure  Support for high‑rate transceivers, DDR4 interfaces, and robust logic resources for baseband processing and backhaul equipment.
• Industrial and test systems  Industrial temperature range and high I/O density enable control, measurement, and protocol bridging in ruggedized equipment.

Unique Advantages

• Substantial programmable fabric: 2,110,000 logic elements provide headroom for large, complex designs and multi‑function integration.
• Large on‑chip memory: 140,509,184 RAM bits reduce reliance on external memory for many buffering and state‑storage needs.
• High connectivity: 688 I/Os and the 1760‑BBGA package enable dense external interfacing and multi‑lane I/O topologies.
• Industrial‑rated operation: Specified for −40 °C to 100 °C, supporting deployment in temperature‑sensitive industrial environments.
• Series‑level system IP: Access to Stratix 10 GX family features such as hard PCIe Gen3, DDR4 memory controllers, DSP blocks, and high‑speed transceiver capabilities for streamlined system design.
• RoHS compliant: Meets lead‑free and hazardous‑substance requirements for modern manufacturing and supply chains.

Why Choose 1SG211HN3F43I3VG?

The 1SG211HN3F43I3VG combines a large Stratix 10 GX logic fabric with substantial on‑chip memory and high I/O density in a compact 1760‑BBGA FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for demanding, long‑lifecycle applications that require robust performance and system integration.

This device is suited to engineers and system designers building high‑bandwidth communications gear, data center accelerators, and industrial systems that benefit from a programmable, high‑capacity FPGA platform and the available series‑level IP and architecture features described in the Stratix 10 GX device overview.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing, and integration support for 1SG211HN3F43I3VG.