1SG211HN3F43E3XG

The 1SG211HN3F43E3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-ball FCBGA package. It combines Intel's Hyperflex core architecture and Stratix 10 family innovations to address advanced applications that require high logic density, substantial on-chip memory, and extensive I/O connectivity.

Designed for high-bandwidth compute and processing tasks, this extended-grade surface-mount device delivers a balance of performance and integration for data center, networking, and compute-accelerated systems while operating from a low-voltage core supply.

Key Features

• Core architecture — Intel Hyperflex core architecture and Stratix 10 family innovations as described in the device overview, delivering increased core performance relative to previous-generation high-performance FPGAs.
• Logic capacity — 2,110,000 logic elements, enabling large, complex designs and high gate-count implementations.
• On-chip memory — 140,509,184 total RAM bits for embedded storage and buffering directly in the FPGA fabric.
• I/O and connectivity — 688 I/O pins to support dense external interfacing and multi-channel system integration.
• Package and mounting — 1760-FBGA (42.5 × 42.5 mm) FCBGA package in a surface-mount configuration for high-pin-count board designs.
• Power — Core voltage supply range 820 mV to 880 mV, supporting low-voltage core operation.
• Temperature and grade — Extended-grade device rated for 0 °C to 100 °C operation and RoHS compliant.
• Family-level capabilities — Stratix 10 GX family features such as high-performance transceiver support, advanced DSP blocks, hard PCIe/ethernet IPs and scalable fabric and memory resources are included in the device family overview.

Typical Applications

• Data center acceleration — FPGA-based compute offload, inline processing, and packet processing where large logic capacity and on-chip memory reduce external bottlenecks.
• High-speed networking — Line card and switch applications that benefit from the family’s transceiver and high I/O count for multi-channel connectivity.
• High-performance signal processing — DSP and algorithm acceleration that leverage extensive RAM bits and the Stratix 10 family’s variable-precision DSP resources.
• Complex system integration — Custom SoC and module designs requiring dense logic resources, abundant I/O, and a compact high-pin-count package.

Unique Advantages

• High logic density: 2,110,000 logic elements enable implementation of large, complex designs without immediate reliance on external processors.
• Substantial on-chip memory: 140,509,184 RAM bits provide extensive embedded storage for buffering, lookup tables, and data staging.
• Extensive I/O count: 688 I/Os support rich peripheral and multi-channel front-end connectivity in demanding system architectures.
• Compact high-pin package: 1760-FBGA (42.5 × 42.5 mm) FCBGA delivers high pin density in a standardized surface-mount footprint for system-level integration.
• Low-voltage core operation: 820 mV–880 mV supply range supports efficient core power delivery for optimized power budgets.
• Extended operating range: 0 °C–100 °C grade suited to a broad set of commercial and datacenter environments.

Why Choose 1SG211HN3F43E3XG?

The 1SG211HN3F43E3XG places Stratix 10 GX family capabilities into a high-density, surface-mount FCBGA package, combining large logic element counts, significant on-chip RAM, and a high I/O count for complex, high-throughput designs. Its extended-grade temperature range and low-voltage core supply make it suitable for demanding compute and networking applications that require both performance and integration.

This device is a fit for design teams targeting large-scale FPGA implementations where dense logic, ample embedded memory, and broad connectivity are required, and where the Stratix 10 family’s advanced architecture can be leveraged for system-level differentiation and long-term scalability.

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