1SG211HN3F43E2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2110000 1760-BBGA, FCBGA

Quantity 333 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs263750Number of Logic Elements/Cells2110000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits140509184

Overview of 1SG211HN3F43E2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2110000 1760-BBGA, FCBGA

The Intel Stratix® 10 GX FPGA 1SG211HN3F43E2VG is a high-density, high-performance field programmable gate array optimized for advanced bandwidth and compute applications. Built on the Stratix 10 family architecture, it pairs the Intel Hyperflex™ core architecture and Intel 14 nm process innovations to address demanding communications, compute acceleration, and high-throughput signal processing use cases.

This device provides a combination of large logic capacity, extensive on-chip RAM, and broad I/O plus package options to enable complex, high-performance system designs that require substantial programmable fabric and robust I/O support.

Key Features

  • Core & architecture  All-new Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process technology, providing family-level performance and power advantages described for Stratix 10 devices.
  • Logic capacity  Approximately 2,110,000 logic elements to implement large, complex programmable designs.
  • On-chip memory  Total RAM capacity of 140,509,184 bits, supported by Stratix 10 internal SRAM block structures (M20K memory blocks as part of the family architecture).
  • I/O and package  688 I/O pins with a 1760-BBGA FCBGA package (supplier device package: 1760-FBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
  • High-speed transceivers and interfaces  Series-level transceiver technology and interface IP in the Stratix 10 family support high data-rate serial links and protocol hard IP (family overview includes up to 28.3 Gbps transceiver data rates and hard PCI Express and Ethernet IP options).
  • Power supply and operating range  Core voltage supply range of 770 mV to 970 mV and an operating temperature range of 0 °C to 100 °C; device grade specified as Extended.
  • Advanced DSP and compute  Family-level variable-precision DSP blocks and architecture innovations provide high compute capability for signal processing workloads.

Typical Applications

  • High-performance networking  Leverage the device's high logic density, extensive I/O and Stratix 10 transceiver technology to implement line-rate packet processing, switching and protocol offload functions.
  • Data center acceleration  Large logic capacity and substantial on-chip RAM make this FPGA suitable for custom acceleration engines, data-plane processing, and compute offload tasks.
  • High-bandwidth interconnects  Use the device's family-level high-speed transceiver capability and abundant I/O to build high-throughput chip-to-chip and backplane interfaces.
  • Signal processing and DSP  High logic and memory resources combined with Stratix 10 DSP blocks support complex fixed- and floating-point signal processing chains.

Unique Advantages

  • High logic density: With approximately 2,110,000 logic elements, the device supports large, integrated designs without partitioning across multiple FPGAs.
  • Substantial on-chip memory: 140,509,184 bits of RAM enable deep buffering, large lookup tables, and stateful processing directly in the FPGA fabric.
  • Robust I/O and packaging: 688 I/O pins in a 1760-BBGA (1760-FBGA package) provide extensive external connectivity while supporting surface-mount assembly.
  • Series-level high-speed capabilities: Stratix 10 family transceiver and protocol IP options (including PCIe and Ethernet hard IP described in the family overview) help accelerate implementation of complex interfaces.
  • Power and process advantages: Intel 14 nm FinFET process and Hyperflex architecture (family features) contribute to improved performance-per-watt for high-throughput designs.
  • Extended-grade operation: Specified operating range of 0 °C to 100 °C and extended grade classification align with demanding commercial and data center environments.

Why Choose 1SG211HN3F43E2VG?

The 1SG211HN3F43E2VG Stratix 10 GX FPGA delivers a balance of very high logic capacity, significant on-chip memory, and extensive I/O in a 1760-BBGA package. It is positioned for engineers building advanced communications, compute acceleration, and signal processing systems that require large programmable fabric combined with high-speed interface capability described for the Stratix 10 family.

Choosing this device provides a path to scalable designs that leverage family-level innovations—Hyperflex architecture, advanced process technology, and high-speed interface IP—backed by Intel's Stratix 10 device ecosystem and documentation.

Request a quote or submit an inquiry to start evaluating 1SG211HN3F43E2VG for your next high-performance FPGA design project.

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