1SG211HN2F43I2VG

The 1SG211HN2F43I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package. It delivers high logic density and on-chip memory for advanced, computation- and bandwidth‑oriented designs.

Built on the Stratix 10 GX family architecture, this device targets high‑performance applications that require extensive programmable logic, large embedded memory, many I/O pins, and industrial operating range.

Key Features

• Logic Capacity  Provides 2,110,000 logic elements for complex digital designs and large-scale hardware acceleration.
• On‑Chip Memory  Includes 140,509,184 total RAM bits to support large buffering, lookup tables, and in‑fabric data storage.
• I/O Density  Offers 688 I/O pins to support wide external interfaces and high channel counts.
• Family Architecture  Based on the Intel Stratix 10 GX family architecture, which incorporates the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process as described in the device overview.
• High‑Speed Transceiver and System Features (Family‑level)  The Stratix 10 GX family includes heterogeneous 3D SiP transceiver tiles and high‑rate transceiver options; refer to family documentation for channel counts and data‑rate capabilities.
• Power Supply  Operates from a core voltage supply range of 770 mV to 970 mV, enabling low‑voltage core operation.
• Industrial Grade & Temperature Range  Rated for industrial operation from −40°C to 100°C.
• Package  Ships in a 1760‑BBGA FCBGA package (supplier package 1760‑FBGA, 42.5 × 42.5 mm) suitable for surface‑mount applications.
• Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Use where large logic capacity and many I/Os are required to implement packet processing, switching, and protocol offload functions.
• Data Center Acceleration  Suitable for compute and I/O acceleration tasks that need dense programmable logic and significant on‑chip memory.
• High‑Speed Communications  Fits designs requiring substantial I/O bandwidth and family‑level transceiver capabilities for backplane and module links.
• Signal Processing and DSP  Applicable to advanced signal processing workloads that benefit from large embedded RAM and extensive logic resources.

Unique Advantages

• Massive Logic Resources:  2.11M logic elements enable complex SoC‑like implementations within the FPGA fabric, reducing the need for external ASICs.
• Extensive On‑Chip Memory:  140.5M bits of RAM support deep buffering and in‑fabric data structures for high‑throughput designs.
• High I/O Count:  688 I/Os allow direct interfacing to multiple high‑speed peripherals and wide parallel buses without additional multiplexing.
• Industrial Temperature Rating:  −40°C to 100°C operation supports deployment in industrial environments.
• Compact High‑Density Package:  1760‑BBGA (42.5 × 42.5 mm) provides a high pin‑count surface‑mount solution for space‑constrained boards.
• Standards‑Aligned Family Capabilities:  As part of the Stratix 10 GX family, the device benefits from family‑level innovations such as the Hyperflex core architecture and advanced transceiver and memory controller IP described in Intel documentation.

Why Choose 1SG211HN2F43I2VG?

The 1SG211HN2F43I2VG combines very large programmable logic capacity, substantial on‑chip memory, and a high I/O count in an industrial‑rated, RoHS‑compliant FCBGA package. It is positioned for engineers designing high‑bandwidth, compute‑intensive systems that require a dense, integrated FPGA platform backed by the Stratix 10 GX family architecture.

Choose this device when your design demands scalable logic resources, significant embedded RAM, and a robust package and thermal range for industrial deployments, while leveraging the Stratix 10 GX family innovations documented by Intel.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 1SG211HN2F43I2VG.