1SG211HN2F43E2VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2110000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 490 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 263750 | Number of Logic Elements/Cells | 2110000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 140509184 |
Overview of 1SG211HN2F43E2VGAS – Stratix® 10 GX FPGA, 1760-BBGA
The 1SG211HN2F43E2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760‑BBGA FCBGA package. This device pairs the Stratix 10 family’s advanced core architecture with high I/O density and large on‑chip memory to address demanding bandwidth and processing requirements.
Built on the Stratix 10 platform, the device leverages the family’s Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology to deliver a high‑performance FPGA solution suitable for compute‑ and I/O‑intensive applications, with an extended operating grade and RoHS compliance.
Key Features
- Core & architecture Intel Stratix 10 Hyperflex core architecture and 14 nm tri‑gate (FinFET) technology provide the family platform for high core performance and power efficiency.
- Logic capacity 2,110,000 logic elements available for implementing complex custom logic and control functions.
- On‑chip memory 140,509,184 total RAM bits deliver substantial embedded memory for buffering, packet processing, and local data storage.
- I/O and package 688 I/O pins in a 1760‑BBGA (supplier package 1760‑FBGA, 42.5 × 42.5 mm) surface‑mount package support dense external connectivity and board‑level integration.
- Transceivers and high‑speed connectivity Stratix 10 family features heterogeneous 3D SiP transceiver tiles and high‑speed transceiver capabilities (family data cites transceiver data rates up to 28.3 Gbps), enabling high‑bandwidth serial links and backplane interfaces.
- Hard IP and system interfaces Family architecture includes hard IP blocks such as PCI Express Gen3 x16, 10G Ethernet, and memory controllers supporting high‑speed DDR4 operation.
- DSP and processing Family variable precision DSP blocks and architecture support demanding signal processing workloads (family information includes high compute capability for DSP functions).
- Power and operating range Core voltage supply range: 770 mV to 970 mV. Operating temperature: 0 °C to 100 °C. Device grade: Extended.
- Compliance RoHS compliant for environmental and manufacturing compliance.
Typical Applications
- High‑performance networking and switching Use the device’s high logic capacity, abundant I/O, and family transceiver capabilities for packet processing, traffic management, and line‑rate switching.
- Data center acceleration Large on‑chip memory and substantial logic resources enable custom accelerators for encryption, compression, and low‑latency compute tasks.
- Telecom and backplane systems High‑speed serial transceiver support and hard IP for Ethernet and PCI Express make this FPGA suitable for line card and backplane interface designs.
- Signal processing and DSP Built‑in DSP capabilities and wide embedded RAM are useful for real‑time processing, filtering, and algorithm acceleration in communication systems.
Unique Advantages
- High logic density: 2,110,000 logic elements provide the capacity to implement large, complex designs without partitioning across multiple devices.
- Substantial embedded memory: 140,509,184 total RAM bits reduce the need for external buffering and support large on‑chip datasets.
- Extensive I/O in a compact package: 688 I/O in a 1760‑BBGA package allows dense connectivity while maintaining a single‑chip solution footprint.
- Advanced family architecture: Hyperflex core architecture and Intel 14 nm tri‑gate technology (family features) deliver a platform optimized for high performance and power efficiency.
- System integration with hard IP: Family hard IP for PCIe, Ethernet, and memory controllers simplifies common system interfaces and reduces integration time.
- Extended temperature grade: Rated for 0 °C to 100 °C operation to meet designs targeting extended ambient ranges.
Why Choose 1SG211HN2F43E2VGAS?
The 1SG211HN2F43E2VGAS delivers a combination of high logic capacity, sizable embedded RAM, and abundant I/O in a single Stratix 10 GX device. It is positioned for designs that require substantial on‑chip resources and high‑speed connectivity while leveraging the Stratix 10 family’s advanced architecture.
This FPGA is suited to engineering teams building high‑bandwidth networking, data center acceleration, telecommunications, or DSP‑intensive systems that benefit from integrated hard IP, dense I/O, and an extended operating grade—providing a scalable platform and a robust set of family features for long‑lifecycle designs.
Request a quote or submit an RFQ for 1SG211HN2F43E2VGAS to obtain pricing and availability information for your project requirements.

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