1SG211HN2F43E2VG

The 1SG211HN2F43E2VG is an Intel Stratix® 10 GX field programmable gate array delivered in a 1760‑FBGA (42.5 × 42.5 mm) surface‑mount package. It features the Intel Hyperflex core architecture and is intended for advanced, high‑performance applications that require large programmable logic capacity, significant embedded memory, and extensive I/O.

With 2,110,000 logic elements, 140,509,184 bits of on‑chip RAM and 688 I/O pins, this device is positioned for demanding networking, communications, data center acceleration and high‑bandwidth signal processing use cases. The device operates from a 770 mV to 970 mV core supply and across an extended temperature range of 0 °C to 100 °C, and is RoHS compliant.

Key Features

• Core & Logic 2,110,000 logic elements driven by the Intel Hyperflex core architecture for increased core performance as described in the Stratix 10 family overview.
• Embedded Memory 140,509,184 total RAM bits of on‑chip memory to support large buffering, frame storage and high‑throughput data paths.
• I/O and Connectivity 688 user I/O pins in a 1760‑FBGA package to support dense system interfaces and board routing.
• Package 1760‑BBGA (FCBGA) supplier device package, 42.5 × 42.5 mm, surface mount footprint for high‑density PCB integration.
• Power Core supply range of 770 mV to 970 mV for core voltage planning and power budgeting in your design.
• Temperature & Grade Extended grade operation from 0 °C to 100 °C suitable for systems that require a wider-than-commercial operating range.
• Standards & Compliance RoHS compliant, aligning with common materials-regulatory requirements.
• Stratix 10 Family Technologies Family features described in the device overview include Intel Hyperflex architecture and high‑performance transceiver and memory subsystem capabilities relevant to the Stratix 10 GX/SX family.

Typical Applications

• High‑Performance Networking and Switching Implement packet processing, protocol offload and line‑rate switching with large logic capacity and abundant I/O.
• Data Center Acceleration Use on‑chip RAM and logic resources for custom acceleration tasks such as search, compression or encryption in data center appliances.
• Telecommunications and Backplane Systems Support high‑bandwidth links and board‑to‑board interfaces using the device’s high I/O count and Stratix 10 family transceiver capabilities.
• High‑Throughput Signal Processing Deploy large FPGA fabric and internal memory for video, radar, and DSP pipelines requiring massive parallelism.

Unique Advantages

• High Logic Density: 2,110,000 logic elements provide the capacity to implement large, complex designs on a single device.
• Substantial On‑Chip Memory: 140,509,184 bits of RAM reduce external memory dependencies for buffering and stateful processing.
• Extensive I/O: 688 I/O pins in a compact 1760‑FBGA package enable flexible interfacing with high‑pin‑count systems.
• Design‑Level Power Control: Defined core voltage range (770 mV–970 mV) supports precise power budgeting in system design.
• Extended Operating Range: 0 °C to 100 °C grading supports applications requiring broader ambient tolerance than standard commercial devices.
• Regulatory Compliance: RoHS compliance simplifies materials and regulatory planning for product assemblies.

Why Choose 1SG211HN2F43E2VG?

The 1SG211HN2F43E2VG delivers a combination of high logic capacity, large embedded memory and a high I/O count packaged in a 1760‑FBGA footprint—making it suitable for complex, bandwidth‑intensive systems. As a Stratix 10 GX family member, it leverages family‑level architectural innovations described in the device overview to address demanding processing and interface requirements.

This device is well suited for engineering teams designing network, communications, data center and high‑throughput signal processing equipment that require scalable FPGA resources, precise power planning, and a compact, high‑pin‑count package.

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