1SG211HN2F43E2LG

The 1SG211HN2F43E2LG is an Intel Stratix 10 GX field programmable gate array supplied in a 1760-BBGA (FCBGA) package. Built on the Stratix 10 GX family architecture, it combines a high-density logic fabric with substantial on-chip RAM and extensive I/O to address demanding high-performance and data throughput applications.

This device is optimized for designs requiring large programmable logic capacity, significant embedded memory, and broad external interfacing, offering a platform for advanced networking, compute acceleration, and high-speed communication systems within an extended temperature grade.

Key Features

• Core & architecture  Family features include the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process as described for Stratix 10 GX devices.
• Logic capacity  2,110,000 logic elements, providing high-density programmable logic for complex designs.
• Embedded memory  140,509,184 total RAM bits of on-chip memory for buffering, data storage, and high-throughput processing.
• High-density I/O  688 user I/O pins to support wide external interfacing and parallel data paths.
• Package & mounting  1760-BBGA (FCBGA) surface-mount package; supplier device package 1760-FBGA with a 42.5 × 42.5 mm footprint.
• Power supply  Core voltage supply range of 820 mV to 880 mV.
• Operating range & grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Device family interfaces  Stratix 10 GX family documentation highlights high-speed transceiver technology and hard IP for common high-bandwidth protocols (family-level features).
• RoHS compliant  Device is compliant with RoHS requirements.

Typical Applications

• High-performance networking  Use the device’s large logic capacity and extensive I/O to implement packet processing, switching, and protocol acceleration.
• Data center acceleration  Deploy as a programmable accelerator for compute offload, encryption, or specialized data-path processing leveraging abundant logic and on-chip RAM.
• High-speed communications  Implement multi‑lane interfaces and protocol PHY/PCS logic that require significant I/O and memory resources.
• Complex digital signal processing  Support large DSP pipelines and buffering with the device’s high logic element count and substantial embedded RAM.

Unique Advantages

• High logic density: 2,110,000 logic elements enable implementation of large, feature-rich designs without partitioning across multiple devices.
• Large on-chip memory: 140,509,184 total RAM bits reduce reliance on external memory for many buffering and scratchpad needs, simplifying system design.
• Extensive external interfacing: 688 I/O pins accommodate wide buses, multi-lane interfaces, and simultaneous peripheral connections.
• Compact, production-ready package: 1760-BBGA FCBGA (42.5 × 42.5 mm) surface-mount package supports high-density board integration.
• Power-efficient core voltage range: Narrow 820 mV–880 mV supply range supports predictable core power planning for complex systems.
• Extended temperature operation: 0 °C to 100 °C operating range suited for many commercial and enterprise environments.

Why Choose 1SG211HN2F43E2LG?

The 1SG211HN2F43E2LG delivers a combination of large programmable logic, substantial on-chip memory, and broad I/O in a single Stratix 10 GX device package. It positions designers to implement complex, high-throughput systems with fewer external components and a compact board footprint.

This device is well suited for engineering teams building advanced networking, communications, and compute-acceleration solutions that require scalable logic capacity and robust interfacing. Backed by the Stratix 10 GX family architecture, it offers a pathway to scalable designs and long-term platform support.

Request a quote or submit an inquiry to start a procurement conversation for 1SG211HN2F43E2LG and evaluate its fit for your next high-performance FPGA design.