1SG211HN1F43I1VG

The 1SG211HN1F43I1VG is an Intel Stratix® 10 GX field programmable gate array in a 1760-FBGA (42.5 × 42.5 mm) package designed for high-density, high-performance applications. It combines a large programmable fabric with extensive on-chip RAM and high I/O count to address demanding networking, compute acceleration, and communications tasks.

Built on Intel’s Stratix 10 family innovations, the device leverages the Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process to deliver increased core performance and improved power efficiency for systems that require significant logic, memory, and I/O resources.

Key Features

• Architecture & Process  Intel Hyperflex core architecture implemented on Intel 14 nm tri-gate (FinFET) technology, providing a platform-level foundation for higher core performance and improved energy efficiency.
• Logic Capacity  2,110,000 logic elements for implementing large-scale programmable designs and complex datapaths.
• On‑Chip Memory  140,509,184 total RAM bits of internal memory to support buffering, large state machines, and memory-intensive algorithms.
• I/O & Package  688 I/O pins in a 1760-FBGA (1760-BBGA, FCBGA) surface-mount package (42.5 × 42.5 mm) for dense board integration and extensive external connectivity.
• Power & Supply  Core voltage supply range from 770 mV to 970 mV to accommodate system-level power planning and low-voltage operation.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for deployment in temperature-challenging environments.
• Family-Level Performance Features  Stratix 10 family innovations include high-speed transceivers, hard PCI Express IP, fractional synthesis PLLs, M20K internal SRAM blocks, and variable-precision DSP blocks—enabling high-bandwidth connectivity and accelerated signal processing where these family features are used.
• Mounting  Surface-mount package suitable for modern PCB assembly and integration workflows.

Typical Applications

• High‑Performance Networking: Implement packet processing, line-card logic, and backplane interfacing using the device’s large logic capacity and extensive I/O.
• Data Center Acceleration: Offload compute-heavy tasks and implement custom accelerators that benefit from large on-chip RAM and abundant logic elements.
• Telecom & Optical Systems: Support high-bandwidth transceiver interfaces and protocol processing in communication equipment.
• Signal Processing & DSP: Deploy large DSP pipelines and buffering for real-time processing using the device’s memory and logic resources.

Unique Advantages

• High Logic Density: 2,110,000 logic elements enable complex designs and integration of multiple subsystems into a single device, reducing board-level component count.
• Large On‑Chip Memory: 140,509,184 RAM bits provide substantial storage for frame buffers, FIFOs, and state data, improving performance for memory-intensive applications.
• Extensive I/O in a Compact Package: 688 I/O pins in a 1760-FBGA (42.5 × 42.5 mm) allow high channel counts and flexible routing while keeping board footprint efficient.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in a wide range of deployed environments.
• Low-Voltage Core Operation: Core supply between 770 mV and 970 mV supports modern low-voltage system architectures and power-optimized designs.
• Proven Family Innovations: Stratix 10 family features—such as Hyperflex architecture, high-speed transceivers, hard IP blocks, and variable-precision DSP—provide a versatile platform for bandwidth- and compute-intensive implementations.

Why Choose 1SG211HN1F43I1VG?

The 1SG211HN1F43I1VG positions itself as a high-capacity, industrial-grade FPGA solution for system designs that demand large programmable logic resources, substantial on-chip memory, and extensive I/O. Its Stratix 10 family heritage—combining Hyperflex architecture and 14 nm FinFET process advantages—delivers a balance of performance and efficiency for advanced networking, data center acceleration, telecom, and signal-processing applications.

Engineers and procurement teams seeking a scalable, robust FPGA with verified family-level features and strong on-chip resources will find this device well-suited for integrating complex functions and reducing BOM count through consolidation of logic and memory on a single package.

Request a quote or submit an inquiry to get pricing and availability for 1SG211HN1F43I1VG.