1SG211HN1F43E1VG

The 1SG211HN1F43E1VG is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) package, delivering high logic density and on-chip memory for advanced bandwidth- and compute‑intensive designs. The device leverages the Stratix 10 family architecture, including the Intel Hyperflex™ core and Intel 14 nm tri‑gate (FinFET) process innovations described in the device overview.

This part targets applications that require significant programmable logic, large on-chip RAM, and broad I/O—providing a balance of performance, integration, and power efficiency for high-performance communications, compute acceleration, and signal processing systems.

Key Features

• Core and Architecture Intel Hyperflex™ core architecture on Intel 14 nm tri‑gate (FinFET) technology, with family-level innovations that improve core performance for high-performance FPGA designs.
• Logic Capacity 2,110,000 logic elements (cells) for implementing large, complex logic functions and control structures.
• On‑chip Memory 140,509,184 total RAM bits, supporting large buffering and on‑chip data storage for high-throughput processing.
• I/O and Connectivity 688 I/O pins to support broad external interfacing. Stratix 10 family documentation also describes high-speed transceiver support and hard IP options for demanding link and protocol requirements.
• Package and Mounting 1760‑BBGA (FCBGA) surface-mount package; supplier device package specified as 1760‑FBGA with a 42.5 × 42.5 mm footprint.
• Power Core voltage supply range of 770 mV to 970 mV to match low-voltage FPGA core requirements.
• Temperature and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Reliability and Safety Features Stratix 10 family features include device-level reliability mechanisms such as single event upset (SEU) detection and correction options documented in the device overview.
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• High‑performance Networking and Communications Implement packet processing, protocol offload, and high-speed interface logic where large logic capacity and extensive I/O are required.
• Compute Acceleration and Signal Processing Use large on‑chip RAM and dense logic resources for DSP pipelines, dataflow acceleration, and high‑throughput compute tasks.
• Storage and Memory Interfaces Implement custom memory controllers, buffering, and PHY-level logic leveraging the device’s RAM and I/O resources for high-speed data paths.
• Prototype and System Integration Integrate complex system functions and prototype SoC-like behavior with high logic density and broad external connectivity in a single FPGA package.

Unique Advantages

• High Logic Density: 2,110,000 logic elements enable large-scale integration of custom logic, reducing the need for multiple devices.
• Substantial On‑chip RAM: 140,509,184 total RAM bits provide ample on‑chip storage for buffering and data manipulation, improving throughput and latency.
• Extensive I/O Count: 688 I/O pins allow complex external interfacing and broad peripheral connectivity without external multiplexing.
• Compact, High‑pin Package: 1760‑BBGA (42.5 × 42.5 mm) FCBGA package delivers high pin count in a compact surface‑mount form factor for dense system designs.
• Low‑voltage Core Operation: Core voltage range of 770 mV to 970 mV supports modern low‑power FPGA core requirements.
• Extended Grade and RoHS Compliance: Extended grade operation (0 °C to 100 °C) and RoHS compliance support a wide range of commercial and industrial applications.

Why Choose 1SG211HN1F43E1VG?

This Stratix 10 GX FPGA part combines dense programmable logic, a large embedded RAM footprint, and broad I/O in a compact 1760‑BBGA package, making it well suited for advanced communications, compute acceleration, and high‑density integration tasks. Its architecture and family innovations described in the Stratix 10 device overview provide a foundation for delivering higher core performance and efficient implementation of demanding logic and signal processing functions.

Choose 1SG211HN1F43E1VG when your design requires significant on‑chip resources, extensive external connectivity, and a proven device family foundation—backed by detailed Stratix 10 documentation and device-level reliability features.

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