1SG210HU3F50I3VG

The 1SG210HU3F50I3VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) supplied in a 2397-BBGA (FCBGA) package. It combines a high-density logic fabric with large embedded RAM and a broad I/O count to address demanding bandwidth and compute tasks.

Built around Intel's Stratix 10 family innovations, the device targets high-performance applications that require large numbers of logic elements, significant on-chip memory, and industrial-grade operating conditions.

Key Features

• Core & architecture  Intel Stratix 10 family architecture with Intel Hyperflex core innovations as described in the device overview; designed to improve core performance over previous-generation high-performance FPGAs.
• Logic capacity  2,100,000 logic elements supporting complex, high-density designs and large-scale integration on a single device.
• Embedded memory  133,169,152 total RAM bits of on-chip memory suitable for buffering, packet processing, and large working datasets.
• I/O and package  704 user I/O pins in a 2397-BBGA (FCBGA) package; surface-mount mounting type for standard board assembly flows.
• Power supply  Core voltage supply range of 770 mV to 970 mV, enabling precise power provisioning for the FPGA core.
• Thermal and grade  Industrial operating range from −40 °C to 100 °C, suitable for elevated-temperature industrial environments.
• Standards & compliance  RoHS compliant.
• Family-level capabilities  Stratix 10 family features cited in the device overview include Intel 14 nm tri-gate process, M20K internal SRAM blocks, advanced PLLs, and hard IP options such as PCI Express and high-speed transceivers (as described in the device family overview).

Typical Applications

• High-performance networking  Use for packet processing, switching fabrics, and network function acceleration where dense logic and large on-chip RAM improve throughput and latency.
• Data center compute & acceleration  Suitable for FPGA-based accelerators that require significant logic and memory resources for workloads such as compression, encryption, or custom compute kernels.
• Telecommunications  Deploy in systems requiring robust I/O and high-density logic for PHY/MAC implementations, forward error correction, and protocol processing.
• Industrial systems  Applicable to industrial instrumentation and control platforms that need industrial-grade temperature ranges and high integration to reduce system BOM.

Unique Advantages

• Very high logic density: 2,100,000 logic elements allow consolidation of complex subsystems onto a single FPGA, reducing board-level complexity.
• Large on-chip RAM: 133,169,152 total RAM bits support buffering and data-intensive algorithms without immediate external memory dependence.
• Substantial I/O count: 704 I/Os provide flexibility for wide parallel interfaces, multiple peripherals, and high-pin-count system integration.
• Industrial temperature rating: −40 °C to 100 °C operating range enables deployment in demanding environmental conditions.
• Flexible power window: Core voltage range of 770 mV to 970 mV supports tight power budgeting and system-level power design.
• RoHS compliant: Meets RoHS environmental requirements for a wide range of commercial and industrial product programs.

Why Choose 1SG210HU3F50I3VG?

The 1SG210HU3F50I3VG positions itself as a high-density Stratix 10 GX FPGA option for engineers who need large logic capacity, extensive on-chip RAM, and a substantial I/O footprint in an industrial-grade package. Its combination of 2,100,000 logic elements, 133,169,152 RAM bits, and 704 I/Os makes it suitable for consolidating complex, high-throughput functions onto a single device.

Designed for applications that demand performance and integration, this FPGA delivers the core attributes required for advanced networking, data center acceleration, telecommunications, and industrial systems while adhering to RoHS standards and industrial temperature requirements.

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