1SG210HU2F50I2VG

The 1SG210HU2F50I2VG is an Intel Stratix® 10 GX field programmable gate array provided in a 2397-BBGA (FCBGA) package and specified for industrial-grade operation. This device integrates 2,100,000 logic elements and 133,169,152 total RAM bits with 704 user I/O to support high-density, high-performance digital designs.

Built to leverage the Stratix 10 family architecture, the device targets demanding applications that require a combination of large logic capacity, significant on-chip memory, and robust I/O density while operating across a wide industrial temperature and voltage range.

Key Features

• Logic Capacity  2,100,000 logic elements, suitable for large, complex designs requiring extensive programmable fabric.
• On‑Chip Memory  133,169,152 total RAM bits for buffering, packet processing, or local data storage without external DRAM for many functions.
• I/O Density  704 user I/O pins to support broad interfacing needs and multi-channel system connectivity.
• Package & Mounting  2397-BBGA (FCBGA) supplier device package 2397-FBGA, FC (50×50); surface-mount package suited for board-level integration.
• Power Supply  Core voltage supply range 770 mV to 970 mV to match system power rails and regulator choices.
• Operating Temperature  Industrial temperature grade with an operating range from −40 °C to 100 °C for deployment in harsh environments.
• Grade  Industrial device grade, indicated for applications requiring extended temperature capability.
• Family Innovations  Leverages Stratix 10 family innovations documented for this device series, including the Intel Hyperflex™ core architecture, Intel 14 nm tri‑gate (FinFET) technology, heterogeneous 3D SiP transceiver tiles, and high-speed transceiver capabilities.

Typical Applications

• High‑Performance Networking  Large logic capacity and high I/O count enable packet processing, switching, and custom protocol offload implementations.
• Telecommunications Infrastructure  On‑chip RAM and extensive I/O support buffering, framing, and multi‑channel interface tasks in network equipment.
• Data Center Acceleration  Programmable fabric size and memory resources support custom acceleration functions and protocol processing in data center appliances.
• Industrial Systems  Industrial temperature rating and robust packaging make the device appropriate for control, signal processing, and instrumentation in industrial environments.

Unique Advantages

• High Logic Density:  2,100,000 logic elements provide the headroom to implement large, integrated digital systems on a single device, reducing multi‑FPGA partitioning.
• Substantial On‑Chip Memory:  133,169,152 RAM bits help minimize external memory dependency for many buffering and data‑path tasks, simplifying board design.
• Extensive I/O Count:  704 I/O pins enable flexible interfacing to multiple subsystems, sensors, and high‑speed links without excessive multiplexing.
• Industrial Temperature Range:  Rated −40 °C to 100 °C for deployment in temperature‑challenging installations common in industrial and infrastructure markets.
• Compact, Surface‑Mount Package:  2397‑BBGA FCBGA footprint balances high pin count with a standardized surface‑mount package for modern PCB assembly.
• Stratix 10 Family Capabilities:  Built on Stratix 10 family architecture elements such as the Hyperflex core and 14 nm FinFET technology, offering design scalability across the family.

Why Choose 1SG210HU2F50I2VG?

The 1SG210HU2F50I2VG positions itself for projects that demand high programmable logic capacity, large on‑chip memory, and significant I/O connectivity within an industrial temperature envelope. Its combination of 2,100,000 logic elements, 133,169,152 RAM bits, and 704 I/O pins supports complex data‑path, protocol, and compute tasks while reducing the need for multiple devices.

Engineers designing networking, telecom, data center acceleration, or industrial control systems will find this device suited to high‑density implementations that benefit from the Stratix 10 family’s architectural advances and package options, delivering a scalable foundation for long‑term product roadmaps.

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