1SG210HU1F50I2VG

The 1SG210HU1F50I2VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 2397‑BBGA FCBGA package. It combines a high‑density programmable fabric with series-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology.

Designed for industrial applications that require large logic capacity, abundant on‑chip RAM, and extensive I/O, this device provides 2,100,000 logic elements, 133,169,152 bits of embedded RAM, 704 I/Os, wide operating temperature range, and low‑voltage core operation for power‑sensitive designs.

Key Features

• Core & architecture  Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) technology deliver the performance characteristics described for the Stratix 10 GX family.
• Logic capacity  2,100,000 logic elements (logic cells) to implement large, high‑complexity designs.
• On‑chip memory  133,169,152 bits of embedded RAM for buffering, packet handling, and intermediate data storage.
• I/O and high‑speed interfaces  704 general I/O pins to support broad peripheral and board‑level connectivity; family documentation references high‑speed transceiver capabilities and hardened interface IP options.
• Package & mounting  2397‑BBGA, FCBGA (supplier package: 2397‑FBGA, FC 50×50) in a surface‑mount format for dense board integration.
• Power  Core voltage supply range of 770 mV to 970 mV to match low‑voltage system designs.
• Temperature & grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance computing acceleration  Use the device’s large logic capacity and substantial on‑chip RAM for hardware acceleration and custom compute pipelines.
• Network and communications infrastructure  Leverage extensive I/O and the Stratix 10 family’s transceiver and hardened interface capabilities for packet processing, switching, and line cards.
• Data center and storage systems  Implement custom protocol offload, packet buffering, and interface bridging using the device’s logic density and memory resources.
• Advanced signal processing  Deploy large DSP and pipeline implementations that require high logic counts and ample on‑chip RAM for intermediate data storage.

Unique Advantages

• High logic density: 2,100,000 logic elements enable consolidation of large functions into a single device, reducing board count.
• Substantial embedded memory: 133,169,152 bits of on‑chip RAM support large buffers, tables, and data paths without external memory.
• Broad I/O capability: 704 I/Os provide flexible connectivity for diverse front‑end, backplane, and mezzanine interfaces.
• Industrial operating range: −40 °C to 100 °C supports deployment in demanding temperature environments.
• Compact, surface‑mount packaging: 2397‑BBGA FCBGA (50×50) enables high‑density board layouts.
• Low‑voltage core operation: 770–970 mV supply range aligns with modern low‑power system designs.

Why Choose 1SG210HU1F50I2VG?

The 1SG210HU1F50I2VG positions itself for industrial and high‑performance designs that require large programmable fabric, significant on‑chip memory, and extensive I/O in a compact FCBGA footprint. Its specifications make it suitable for complex compute, networking, storage, and signal processing implementations where consolidation and deterministic hardware behavior are priorities.

Selecting this Stratix 10 GX device provides scalability within the Stratix 10 family, access to series‑level architectural innovations, and component characteristics (voltage, temperature, package, RoHS compliance) that support long‑term system reliability and maintainability.

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