1SG210HU1F50E2VG

The 1SG210HU1F50E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 2397-BBGA FCBGA package. It delivers a high-density fabric with 2,100,000 logic elements and 133,169,152 bits of on-chip RAM, targeting high-performance, bandwidth‑intensive applications.

Built on Stratix 10 family innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, this device is positioned for designs that require large logic capacity, extensive I/O, and advanced system-level integration while operating within an extended-grade temperature range.

Key Features

• Core Architecture – Based on the Intel Stratix 10 family innovations, including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology for higher core performance and energy efficiency at the family level.
• Logic Capacity – 2,100,000 logic elements to implement large, complex digital designs and custom hardware functions.
• Embedded Memory – 133,169,152 total RAM bits for wide on-chip buffering, lookup tables, and memory-intensive functions.
• I/O Resources – 704 user I/O pins to support dense peripheral connectivity and multiple high-speed interfaces.
• Package & Mounting – 2397-BBGA FCBGA package (supplier device package: 2397-FBGA, FC 50×50) with surface-mount mounting for compact board-level integration.
• Power Supply – Core voltage supply range 770 mV to 970 mV for device operation.
• Operating Temperature & Grade – Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance – RoHS compliant.
• Family-Level System Features – Stratix 10 family capabilities (as documented for GX/SX devices) include advanced transceiver options, hard IP for PCI Express, variable-precision DSP blocks, and high-speed memory controller support.

Typical Applications

• High-performance networking and communications – Large logic capacity and high I/O count support complex packet processing, switch/router functions, and high-throughput interface aggregation.
• Data center acceleration – On-chip memory and dense logic are suitable for custom accelerators, offload engines, and protocol processing where large compute and buffering are required.
• Signal processing and compute – Extensive embedded RAM and family-level DSP block capabilities support high-throughput digital signal processing and arithmetic-intensive algorithms.
• Backplane and high-speed I/O systems – High I/O count and Stratix 10 family transceiver features enable implementation of high-bandwidth interconnects and board-to-board links.

Unique Advantages

• High logic density: 2,100,000 logic elements enable implementation of complex systems on a single FPGA, reducing board-level partitioning.
• Large embedded memory: 133,169,152 bits of on-chip RAM provide significant buffering and storage for data‑intensive designs.
• Extensive I/O: 704 I/O pins allow flexible connectivity for multiple interfaces and parallel datapaths.
• Compact FCBGA package: 2397-BBGA (2397-FBGA, 50×50) surface-mount package supports dense integration on space-constrained PCBs.
• Controlled core power range: 770 mV–970 mV supply range enables predictable core power budgeting for system design.
• Extended operating grade: 0 °C to 100 °C rating suits designs targeting extended temperature commercial environments.

Why Choose 1SG210HU1F50E2VG?

The 1SG210HU1F50E2VG combines Stratix 10 family innovations with device-level capacity—2.1 million logic elements, substantial on-chip RAM, and 704 I/Os—to address demanding designs that require high logic density, extensive memory, and broad connectivity. Its FCBGA packaging and controlled voltage and temperature ranges make it suitable for high-performance systems where board space and predictable thermal/power characteristics matter.

Designed within the Intel Stratix 10 GX family framework, this FPGA is appropriate for engineering teams building scalable, high-throughput hardware solutions that rely on documented Stratix 10 architecture features and Intel-supported device documentation.

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