1SG210HN3F43E3VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 61 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262500 | Number of Logic Elements/Cells | 2100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 133169152 |
Overview of 1SG210HN3F43E3VG – Stratix® 10 GX FPGA, 1760-BBGA
The 1SG210HN3F43E3VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA surface-mount package. Built for high-performance applications, this device combines a large FPGA fabric with extensive on-chip memory and a wide I/O count to address demanding communications, data center, and signal-processing designs.
As part of the Stratix 10 family, this GX device benefits from family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering high core performance and power efficiency for advanced system designs.
Key Features
- High logic capacity — 2,100,000 logic elements to implement large, complex hardware designs and system functions on a single device.
- On-chip memory — 133,169,152 total RAM bits for deep buffering, large-state machines, and data-path storage without external memory.
- Extensive I/O — 688 user I/O pins support broad connectivity to peripherals, memory interfaces, and high-speed I/O fabrics.
- Advanced packaging — 1760-BBGA (supplier device package: 1760-FBGA, 42.5 × 42.5 mm) surface-mount package for dense system integration.
- Power and thermal — Core voltage supply range of 770 mV to 970 mV and operating temperature range of 0 °C to 100 °C, suitable for extended-grade deployments.
- Family-level innovations — Stratix 10 family features such as Hyperflex core architecture, FinFET process, variable-precision DSP blocks, and available high-speed transceiver and hard-IP options (PCIe, Ethernet, memory controllers) to accelerate system design.
- Standards and compliance — RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.
Typical Applications
- High-speed networking — Use in switches, routers, and line cards where high logic capacity and extensive I/O enable packet processing, complex forwarding engines, and protocol offload.
- Data center acceleration — Implement hardware accelerators, custom compute kernels, and protocol adapters that leverage large on-chip RAM and massive logic density.
- Advanced communications — Support for multi-channel, high-bandwidth transceiver interfaces and signal-processing pipelines for optical and backplane systems.
- High-performance signal processing — Large DSP and memory resources for real-time processing in test equipment, radar, and scientific instrumentation.
Unique Advantages
- Large programmable fabric: 2.1 million logic elements provide the capacity to consolidate multiple system functions into one device, reducing BOM and board complexity.
- Significant on-chip memory: 133 million bits of RAM reduce dependence on external memory and improve latency for buffering and streaming applications.
- High I/O density: 688 I/O pins enable complex bus interfaces, wide memory buses, and numerous peripheral connections without additional multiplexing hardware.
- Extended-grade operation: Specified for 0 °C to 100 °C operation and RoHS compliance for deployment in a wide range of commercial and telecommunication environments.
- Designed for high-performance systems: Family innovations such as the Hyperflex core architecture and 14 nm FinFET technology support higher core performance and power efficiency in demanding designs.
- Compact, high-pin-count package: 1760-FBGA (42.5 × 42.5 mm) enables dense routing and integration in space-constrained, high-throughput systems.
Why Choose 1SG210HN3F43E3VG?
The 1SG210HN3F43E3VG positions itself for complex, performance-driven designs that require a large programmable fabric, substantial on-chip memory, and a high I/O count in a single FPGA device. Its extended-grade operating range, RoHS compliance, and advanced Stratix 10 family technologies make it suitable for communications, data center, and high-performance signal-processing applications.
Design teams targeting consolidation of system functions, reduced external memory dependency, and high-bandwidth interfacing will find this device a strong choice for scalable, future-proof designs backed by the Stratix 10 family roadmap and ecosystem.
Request a quote or submit an inquiry to check availability, lead times, and pricing for the 1SG210HN3F43E3VG. Our team will provide the details you need to move your design forward.

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