1SG210HN2F43I2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2100000 1760-BBGA, FCBGA

Quantity 243 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262500Number of Logic Elements/Cells2100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits133169152

Overview of 1SG210HN2F43I2VG – Stratix® 10 GX FPGA IC, 1760-FBGA (42.5×42.5)

The 1SG210HN2F43I2VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 1760-FBGA surface-mount package. It delivers high logic density, large embedded RAM, and extensive I/O to address advanced, bandwidth‑and‑compute‑intensive designs.

Built on the Stratix 10 family innovations, the device leverages the Intel Hyperflex core architecture and 14 nm FinFET technology to target high-performance networking, compute acceleration, and high-speed interface applications while supporting industrial temperature ranges and low-voltage core operation.

Key Features

  • Core Architecture  Intel Hyperflex™ core architecture (Stratix 10 family) providing significant core performance improvements over previous-generation high-performance FPGAs.
  • Logic Capacity  Approximately 2,100,000 logic elements for implementing large-scale custom logic and complex state machines.
  • Embedded Memory  133,169,152 total RAM bits to support on-chip buffering, packet processing, and data‑intensive acceleration functions.
  • I/O and High-Speed Interfaces  688 user I/Os and Stratix 10 family transceiver capabilities (family-level transceiver features include full‑duplex channels and multi‑Gbps data rates) for dense interface requirements.
  • Hard IP and DSP  Stratix 10 family devices include hard IP for PCI Express and high‑speed Ethernet and feature variable-precision DSP resources for high-throughput signal processing (family-level features listed in the device overview).
  • Power and Voltage  Core supply range 770 mV to 970 mV to match low-voltage system power architectures.
  • Package and Mounting  1760-FBGA package (42.5×42.5 mm), surface-mount format for high-density board integration.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Standards and Reliability (Family-Level)  Stratix 10 family-level features include PLLs, memory controllers, and device security/configuration blocks as described in the device overview.

Typical Applications

  • Data Center Networking  High logic capacity, large embedded RAM, and high-speed I/O make the device suitable for packet processing, switching, and line-card functions.
  • Telecommunications & Backplane Systems  Stratix 10 family transceiver capabilities and hard Ethernet/PCIe IP support high-throughput backplane and transport interfaces.
  • Compute Acceleration & DSP  Large counts of logic elements and family-level DSP resources enable algorithm acceleration and real-time signal processing workloads.
  • High-Speed Interface Bridging  Extensive I/O and transceiver support allow protocol bridging and custom interface implementations for advanced systems.

Unique Advantages

  • High Logic Density:  2,100,000 logic elements provide the headroom to implement large custom accelerators and complex multi-function designs on a single device.
  • Substantial On-Chip Memory:  133,169,152 RAM bits reduce reliance on external memory for buffering and fast data-path operations.
  • Robust I/O Count:  688 I/Os support dense peripheral and high-pin-count interface requirements without multiple devices.
  • Industrial Temperature Range:  −40 °C to 100 °C rating enables deployment in temperature-challenging industrial environments.
  • Low-Voltage Core Operation:  770 mV to 970 mV supply range aligns with modern low-power system rails.
  • Board-Level Integration:  1760-FBGA (42.5×42.5 mm) packaging provides a compact, manufacturable footprint for high-density PCBs.

Why Choose 1SG210HN2F43I2VG?

The 1SG210HN2F43I2VG positions itself where high logic capacity, large embedded memory, and extensive I/O converge. It is suited for engineering teams building demanding communications, networking, and compute-acceleration systems that require significant on-chip resources and industrial temperature operation.

Choosing this Stratix 10 GX FPGA provides scalability within the Stratix 10 family, access to family-level hard IP and architecture innovations, and design flexibility to consolidate complex functions onto a single, high-density device.

If you need pricing, availability, or a formal quote for 1SG210HN2F43I2VG, request a quote or submit an inquiry to receive detailed purchasing and lead-time information.

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