1SG210HN2F43I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 243 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262500 | Number of Logic Elements/Cells | 2100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 133169152 |
Overview of 1SG210HN2F43I2VG – Stratix® 10 GX FPGA IC, 1760-FBGA (42.5×42.5)
The 1SG210HN2F43I2VG is an Intel Stratix® 10 GX field-programmable gate array (FPGA) in a 1760-FBGA surface-mount package. It delivers high logic density, large embedded RAM, and extensive I/O to address advanced, bandwidth‑and‑compute‑intensive designs.
Built on the Stratix 10 family innovations, the device leverages the Intel Hyperflex core architecture and 14 nm FinFET technology to target high-performance networking, compute acceleration, and high-speed interface applications while supporting industrial temperature ranges and low-voltage core operation.
Key Features
- Core Architecture Intel Hyperflex™ core architecture (Stratix 10 family) providing significant core performance improvements over previous-generation high-performance FPGAs.
- Logic Capacity Approximately 2,100,000 logic elements for implementing large-scale custom logic and complex state machines.
- Embedded Memory 133,169,152 total RAM bits to support on-chip buffering, packet processing, and data‑intensive acceleration functions.
- I/O and High-Speed Interfaces 688 user I/Os and Stratix 10 family transceiver capabilities (family-level transceiver features include full‑duplex channels and multi‑Gbps data rates) for dense interface requirements.
- Hard IP and DSP Stratix 10 family devices include hard IP for PCI Express and high‑speed Ethernet and feature variable-precision DSP resources for high-throughput signal processing (family-level features listed in the device overview).
- Power and Voltage Core supply range 770 mV to 970 mV to match low-voltage system power architectures.
- Package and Mounting 1760-FBGA package (42.5×42.5 mm), surface-mount format for high-density board integration.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Standards and Reliability (Family-Level) Stratix 10 family-level features include PLLs, memory controllers, and device security/configuration blocks as described in the device overview.
Typical Applications
- Data Center Networking High logic capacity, large embedded RAM, and high-speed I/O make the device suitable for packet processing, switching, and line-card functions.
- Telecommunications & Backplane Systems Stratix 10 family transceiver capabilities and hard Ethernet/PCIe IP support high-throughput backplane and transport interfaces.
- Compute Acceleration & DSP Large counts of logic elements and family-level DSP resources enable algorithm acceleration and real-time signal processing workloads.
- High-Speed Interface Bridging Extensive I/O and transceiver support allow protocol bridging and custom interface implementations for advanced systems.
Unique Advantages
- High Logic Density: 2,100,000 logic elements provide the headroom to implement large custom accelerators and complex multi-function designs on a single device.
- Substantial On-Chip Memory: 133,169,152 RAM bits reduce reliance on external memory for buffering and fast data-path operations.
- Robust I/O Count: 688 I/Os support dense peripheral and high-pin-count interface requirements without multiple devices.
- Industrial Temperature Range: −40 °C to 100 °C rating enables deployment in temperature-challenging industrial environments.
- Low-Voltage Core Operation: 770 mV to 970 mV supply range aligns with modern low-power system rails.
- Board-Level Integration: 1760-FBGA (42.5×42.5 mm) packaging provides a compact, manufacturable footprint for high-density PCBs.
Why Choose 1SG210HN2F43I2VG?
The 1SG210HN2F43I2VG positions itself where high logic capacity, large embedded memory, and extensive I/O converge. It is suited for engineering teams building demanding communications, networking, and compute-acceleration systems that require significant on-chip resources and industrial temperature operation.
Choosing this Stratix 10 GX FPGA provides scalability within the Stratix 10 family, access to family-level hard IP and architecture innovations, and design flexibility to consolidate complex functions onto a single, high-density device.
If you need pricing, availability, or a formal quote for 1SG210HN2F43I2VG, request a quote or submit an inquiry to receive detailed purchasing and lead-time information.

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