1SG210HN2F43E2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 792 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262500 | Number of Logic Elements/Cells | 2100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 133169152 |
Overview of 1SG210HN2F43E2VG – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC
The 1SG210HN2F43E2VG is an Intel Stratix® 10 GX family FPGA supplied in a 1760‑FBGA (42.5 × 42.5 mm) package. It leverages the Stratix 10 architecture to deliver a high‑capacity programmable fabric with large on‑chip memory and extensive I/O for demanding bandwidth and compute tasks.
This device is targeted at high‑performance networking, communications, and compute applications that require millions of logic elements, abundant RAM, and a broad set of I/O. Key value comes from its large logic and memory resources, high I/O count, integrated power envelope, and platform features described in the Stratix 10 device overview.
Key Features
- Core Architecture Built on the Intel Stratix 10 family architecture; the device family includes the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process as described in the device overview.
- Logic Capacity 2,100,000 logic elements (cells) providing substantial programmable fabric for complex logic and system integration.
- On‑Chip Memory 133,169,152 total RAM bits of internal memory to support buffering, packet processing, and large state storage.
- I/O and Transceivers 688 user I/O pins in a high‑density FBGA package; the Stratix 10 family supports high‑speed transceiver technologies detailed in the device overview.
- DSP and Acceleration Family features include variable‑precision DSP blocks for high‑performance fixed and floating point signal processing (series detail available in the device overview).
- Supply and Power Specified operating core voltage range of 770 mV to 970 mV with integrated power management features described for the family.
- Package and Mounting 1760‑BBGA (FCBGA) package, supplier device package 1760‑FBGA (42.5 × 42.5 mm); surface‑mount device designed for dense system integration.
- Operating Range and Grade Grade: Extended; operating temperature range 0 °C to 100 °C.
- System and Security Device overview documents family capabilities including configuration, secure device manager, and SEU detection and correction features.
- Compliance RoHS compliant.
Typical Applications
- High‑Performance Networking Hardware packet processing, line cards, and backplane systems that require large logic capacity, high I/O counts, and high‑speed transceiver support.
- Data Center Acceleration Custom accelerators and protocol offload engines leveraging extensive on‑chip RAM and DSP resources for throughput and low‑latency processing.
- Telecommunications Equipment PHY and MAC implementations, forward error correction, and high‑speed link aggregation using the Stratix 10 family transceiver and IP capabilities.
- Advanced Signal Processing High‑density DSP implementations that use the device’s large logic fabric and memory for multi‑channel digital signal workflows.
Unique Advantages
- Large Programmable Fabric: 2.1 million logic elements enable integration of complex, system‑level functions on a single device, reducing external logic count.
- Substantial On‑Chip Memory: 133,169,152 RAM bits support deep buffering and large state machines without reliance on external memory for many functions.
- High I/O Density: 688 user I/Os in a 1760‑FBGA package simplify board routing for multi‑lane interfaces and dense connector topologies.
- Platform Features from Stratix 10 Family: Architecture innovations such as Hyperflex cores, FinFET process, and family‑level transceiver/IP options provide a modern FPGA foundation for performance and integration.
- Controlled Power Envelope: Specified core supply range (770 mV–970 mV) and documented power management features support system power planning and thermal design.
- Compliance and Reliability: RoHS compliance and family features for SEU detection and device security help address regulatory and reliability considerations.
Why Choose 1SG210HN2F43E2VG?
The 1SG210HN2F43E2VG delivers a high‑capacity Stratix 10 GX FPGA in a dense 1760‑FBGA package, combining 2.1 million logic elements, extensive on‑chip RAM, and 688 I/O to address complex networking, compute acceleration, and signal processing applications. Its specification set and family features make it suitable for designs that need large programmable resources and integrated platform capabilities.
This device is ideal for engineering teams developing high‑bandwidth systems that require scalability and integration within a documented Stratix 10 device family architecture. The Extended grade and defined operating parameters support deployment in controlled‑environment equipment where the specified temperature and supply ranges match system requirements.
Please request a quote or submit an inquiry to receive pricing, availability, and technical support information for 1SG210HN2F43E2VG.

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