1SG166HN3F43I3VG

The 1SG166HN3F43I3VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It combines a high logic capacity with a large on-chip RAM footprint and extensive I/O to address advanced, high-bandwidth applications.

Built on Stratix 10 family innovations, this device targets performance-critical systems that require substantial programmable logic, on-chip RAM, and flexible I/O while operating across industrial temperature ranges.

Key Features

• Core & architecture 
  Part of the Intel Stratix 10 GX family; leverages family-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process.
• Large logic capacity 
  Provides 1,660,000 logic elements for complex programmable logic designs.
• On-chip memory 
  Includes 125,829,120 total RAM bits to support large buffering, state storage, and data-path implementations.
• I/O and packaging 
  688 I/Os in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) surface-mount package, enabling dense external connectivity.
• Power supply 
  Operates from a core voltage supply range of 770 mV to 970 mV.
• Industrial temperature rating 
  Rated for operation from −40°C to 100°C for deployment in industrial environments.
• Surface-mount package 
  1760-BBGA FCBGA package suitable for automated PCB assembly.
• Compliance 
  RoHS compliant.

Typical Applications

• High-speed communications 
  Large logic capacity and extensive I/O make this FPGA suitable for protocol processing, packet handling, and interface bridging in networking equipment.
• Compute acceleration 
  Substantial on-chip RAM and logic resources enable hardware acceleration workloads and custom data-path implementations.
• Signal processing 
  High logic density and large RAM support complex digital signal processing pipelines and buffering in communications and instrumentation.
• Advanced prototyping and system development 
  Provides a high-capacity programmable fabric for developing and validating large-scale hardware designs.

Unique Advantages

• Exceptional logic scale: 1,660,000 logic elements let you implement large, complex designs without splitting across multiple devices.
• Significant on-chip memory: 125,829,120 RAM bits reduce dependence on external memory for many buffering and state-storage needs.
• High I/O density: 688 I/Os in a compact 1760-BBGA package enable numerous high-speed interfaces and dense board-level integration.
• Industrial robustness: Rated for −40°C to 100°C operation to meet industrial deployment temperature requirements.
• Controlled core voltage range: Core supply range of 770 mV to 970 mV supports precise power budgeting and thermal design.
• Standards-compliant manufacturing: Surface-mount 1760-FBGA package supports automated PCB assembly processes and is RoHS compliant.

Why Choose 1SG166HN3F43I3VG?

The 1SG166HN3F43I3VG delivers a combination of very large programmable logic capacity, extensive on-chip RAM, and high I/O count in a single Stratix 10 GX-class FPGA package. It is well suited for engineers designing high-bandwidth, compute-intensive systems that require significant in-device resources and industrial-grade operating temperatures.

Choosing this device provides scalability for complex designs while leveraging Stratix 10 family technologies for performance and integration. Its package and supply specifications support robust board-level implementation and predictable power/thermal planning.

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