1SG166HN3F43I1VG

The 1SG166HN3F43I1VG is an Intel Stratix® 10 GX field programmable gate array in a 1760‑BBGA (FCBGA) package. It delivers a large logic fabric and on‑chip memory for advanced, high‑performance designs that demand significant processing and bandwidth.

Built on the Stratix® 10 family innovations, this device targets applications requiring high logic density, substantial on‑chip RAM, and extensive I/O while offering industrial temperature operation and RoHS compliance.

Key Features

• Core Capacity  Approximately 1,660,000 logic elements, enabling complex digital designs and large-scale custom logic implementations.
• On‑Chip Memory  125,829,120 total RAM bits to support large buffering, lookup tables, and memory‑intensive algorithms.
• I/O  688 general‑purpose I/O pins for high‑density interfacing to peripherals, memory, and mezzanine modules.
• Stratix 10 Family Architecture  Built on Intel Stratix 10 GX family innovations including the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as described in the device overview.
• High‑Speed Transceiver Capability (Family Feature)  Stratix 10 family documentation highlights heterogeneous 3D SiP transceiver tiles with transceiver data rates up to 28.3 Gbps for demanding serial I/O applications.
• Package & Mounting  1760‑BBGA (FCBGA) supplier device package 1760‑FBGA (42.5 × 42.5 mm); surface‑mount construction for board‑level integration.
• Power Supply  Core voltage supply range specified at 770 mV to 970 mV to support optimized core power delivery.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Performance Networking  Use where high logic density and family transceiver capabilities enable packet processing, switch fabrics, and line‑rate network functions.
• Data Center & Acceleration  Large logic element count and substantial on‑chip RAM support acceleration of compute‑ and memory‑intensive workloads.
• Telecommunications Equipment  Extensive I/O and Stratix 10 family serial I/O features suit backplane interfaces, PHY implementations, and high‑speed link aggregation.
• Advanced Signal Processing  High logic capacity and internal RAM are applicable for DSP pipelines, real‑time processing, and complex algorithm implementation.

Unique Advantages

• High Logic Density:  About 1.66 million logic elements enable large, integrated designs that reduce external ASIC/FPGA partitioning.
• Substantial On‑Chip Memory:  125,829,120 RAM bits provide local storage for buffering, state machines, and lookup tables, lowering external memory dependence.
• Wide I/O Count:  688 I/O pins support rich peripheral integration and flexible system partitioning on a single device.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C to support deployment in industrial environments and temperature‑challenging boards.
• Package for Dense Designs:  1760‑FBGA (42.5 × 42.5 mm) package supports high pin count routing while maintaining a surface‑mount form factor.
• Family‑Level High‑Performance Features:  Leverages Stratix 10 family innovations such as Intel Hyperflex architecture and 14 nm tri‑gate technology to deliver the performance characteristics described in the device overview.

Why Choose 1SG166HN3F43I1VG?

This Stratix® 10 GX device is positioned for engineers and teams building advanced, bandwidth‑ and logic‑intensive systems. With approximately 1.66 million logic elements, extensive on‑chip RAM, and 688 I/O, it supports large designs that require tight integration and high data throughput.

Its industrial temperature rating, surface‑mount 1760‑FBGA package, and RoHS compliance make it suitable for demanding commercial and industrial applications where robustness, scalability, and the Stratix 10 family feature set are important design criteria.

Request a quote or submit an inquiry to receive pricing and availability for 1SG166HN3F43I1VG and to discuss your design requirements.