1SG166HN3F43E2LG

The 1SG166HN3F43E2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) IC supplied in a 1760-BBGA (FCBGA) package. It combines a very large programmable fabric with extensive I/O capability and on-chip RAM to address bandwidth- and compute-intensive applications.

As a member of the Stratix® 10 GX family, the device benefits from the family’s Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering significantly increased core performance and improved power efficiency for demanding networking, compute acceleration, and high-speed connectivity designs.

Key Features

• Logic Capacity — 1,660,000 logic elements for large-scale custom logic, control and compute implementations.
• On‑chip Memory — 125,829,120 total RAM bits to support large buffers, packet staging, and intermediate data storage.
• High I/O Count — 688 I/O pins enabling dense external device connectivity and broad interface options.
• Package & Mounting — 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package for board-level integration.
• Power Supply — Core voltage supply range from 820 mV to 880 mV, suitable for the device’s high-performance fabric.
• Operating Range & Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for reliable operation in commercial and extended-environment applications.
• Series-Level Innovations — As a Stratix 10 GX family device, it leverages the Intel Hyperflex core architecture and heterogeneous 3D SiP transceiver tiles; Stratix 10 series documentation cites up to 2× core performance and up to 70% lower power versus prior-generation high-performance FPGAs.
• Regulatory — RoHS compliant.

Typical Applications

• High‑performance networking — Dense logic and large on‑chip RAM enable packet processing, forwarding engines, and line-rate protocol handling.
• Data center acceleration — Large logic capacity and memory support custom accelerators and data-path offload implementations.
• High-speed communications — Extensive I/O and family transceiver capabilities make the device suitable for backplane and chip-to-chip interconnects.
• Signal processing and DSP — Large fabric and memory enable complex real-time signal processing and algorithm implementation.

Unique Advantages

• Massive programmable fabric: 1,660,000 logic elements provide the headroom for complex, highly parallel logic and custom hardware accelerators.
• Substantial on‑chip memory: 125,829,120 RAM bits reduce reliance on external memory for many buffering and intermediate storage needs, simplifying board design.
• Wide I/O capability: 688 I/O pins support multiple high-density interfaces and diverse peripheral connections on a single device.
• Family innovations applied: Benefits from Stratix 10 GX family innovations such as the Hyperflex core architecture and 14 nm FinFET process for improved performance per watt at system level.
• Robust packaging for board integration: 1760-BBGA (42.5 × 42.5 mm) surface-mount package provides a compact, high-pin-count footprint for complex designs.
• Extended operating grade: 0 °C to 100 °C operating temperature and RoHS compliance address extended-environment reliability and regulatory requirements.

Why Choose 1SG166HN3F43E2LG?

The 1SG166HN3F43E2LG positions itself for applications that require very large programmable logic capacity, significant on‑chip memory, and broad I/O in a single-package solution. Its specification set makes it well suited for designers building high-throughput networking systems, data center accelerators, and high-speed communications equipment that demand substantial custom logic and local memory.

By leveraging Stratix 10 GX family architectural advances documented for the series—such as the Intel Hyperflex core architecture and 14 nm FinFET technology—this device delivers a balance of performance and efficiency while offering the pin count and packaging needed for dense board-level integration. Choose this part when scalability, fabric capacity, and extensive I/O are primary design drivers.

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