1SG166HN2F43I2VG

The 1SG166HN2F43I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) device designed for high-performance digital designs. It leverages the Stratix 10 family innovations and is intended for advanced applications that require large logic capacity, high I/O density, and wide operating temperature capability.

Built on the Stratix 10 device family, the part combines a high logic element count with substantial on-chip RAM and industrial-grade operating range to support demanding networking, compute acceleration, and high-throughput signal processing designs.

Key Features

• Core Architecture Based on the Intel Stratix 10 family innovations, including the Intel Hyperflex core architecture aimed at increasing core performance and delivering improved power efficiency compared to previous generations.
• Logic Capacity 1,660,000 logic elements to implement large, complex designs and high-density custom logic.
• Embedded Memory 125,829,120 total RAM bits of on-chip memory to support buffering, on-chip data storage, and memory-intensive algorithms.
• I/O and Packaging 688 I/Os for broad external device connectivity; supplied in a 1760-BBGA FCBGA package (1760-FBGA, 42.5 × 42.5 mm) for surface-mount PCB assembly.
• Transceivers and High-Speed Interfaces Stratix 10 family technology includes heterogeneous 3D SiP transceiver tiles and high-speed transceiver support; the family references transceiver channel architectures and high data-rate capability suitable for demanding link applications.
• Power and Clocking Core voltage supply range from 770 mV to 970 mV and family-level fractional synthesis PLLs and low-jitter clocking resources to support precise timing and low-power operation.
• Operating Range and Grade Industrial-grade device with an operating temperature range of -40 °C to 100 °C and RoHS compliance for environmental requirements.

Typical Applications

• High‑Performance Networking Use in switches, routers, and line cards that require large logic capacity and high I/O density to manage packet processing and protocol handling.
• Data Center Acceleration Hardware acceleration and custom compute functions where large amounts of on-chip logic and SRAM are needed for throughput and low-latency processing.
• Telecommunications Backplane and Optical Modules Designs requiring high-speed serial links and significant transceiver resources benefit from Stratix 10 family transceiver capabilities and I/O count.
• DSP and Signal Processing Compute- and memory-intensive signal processing algorithms that leverage the device’s large logic fabric and on-chip RAM.

Unique Advantages

• High Logic Density: 1,660,000 logic elements provide capacity for complex, high-performance designs without external logic expansion.
• Substantial On‑Chip Memory: 125,829,120 total RAM bits support large data buffers and on-chip algorithm state storage, reducing external memory dependence.
• Extensive I/O Reach: 688 I/Os enable flexible interfacing to high-pin-count systems, mezzanine cards, and multiple peripheral domains.
• Industrial Temperature Capability: Rated from -40 °C to 100 °C to meet the demands of industrial environments and thermal variability.
• Advanced Family-Level Innovations: Leverages Stratix 10 family features such as the Hyperflex core architecture and 14 nm tri-gate process innovations to improve core throughput and power characteristics.

Why Choose 1SG166HN2F43I2VG?

The 1SG166HN2F43I2VG positions itself for designs that demand very large logic capacity, significant on-chip memory, and dense I/O in an industrial-grade FPGA package. It is well suited for system-level functions that require integrated high-throughput logic, robust operating temperature range, and a compact FCBGA footprint.

By leveraging Stratix 10 family innovations, this device supports architects and engineers building high-bandwidth, compute-intensive systems that need scalable logic resources and mature FPGA capabilities.

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