1SG166HN2F43E2VG

The 1SG166HN2F43E2VG is a Stratix® 10 GX family FPGA in a 1760-BBGA (FCBGA) package. This device leverages the Intel Stratix 10 architecture family innovations to deliver high logic capacity and on-chip memory for compute- and bandwidth-intensive designs.

Designed for systems that require large programmable fabric, substantial embedded RAM, and a high pin count, this part is targeted at advanced communications, data center, and high-performance compute applications where integration and density matter.

Key Features

• Core Logic  1,660,000 logic elements (logic cells) provide substantial programmable fabric for complex designs and large-scale integration.
• Embedded Memory  125,829,120 total RAM bits available on-chip to support buffering, data structures, and high-throughput processing.
• I/O and Package  688 user I/Os in a 1760-BBGA (FCBGA) package; supplier device package size listed as 1760-FBGA (42.5 × 42.5 mm).
• Power  Operating core voltage range specified from 770 mV to 970 mV to align with the device’s power domains.
• Mounting and Grade  Surface-mount package with Extended grade and an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.
• Series-Level Innovations (Stratix 10)  The Stratix 10 family includes Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology, enabling higher core performance and energy efficiency across the family.

Typical Applications

• High-performance networking and switch fabric  Large logic capacity and extensive I/O make this device suitable for packet processing, protocol offload, and switch implementations.
• Data center acceleration  On-chip RAM and dense logic support hardware acceleration tasks and custom compute kernels used in data-center appliances.
• Telecommunications infrastructure  The Stratix 10 family feature set and high I/O count support line-card, PHY, and backplane interface designs.
• High-speed instrumentation and test equipment  Large programmable fabric and abundant memory enable real-time signal processing and complex measurement routines.

Unique Advantages

• Massive programmable capacity: 1,660,000 logic elements provide headroom for large designs and integration of multiple subsystems on a single device.
• Substantial on-chip memory: 125,829,120 total RAM bits reduce dependency on external memory for buffering and on-chip data storage.
• High I/O count in a compact package: 688 I/Os in a 1760-BBGA (42.5 × 42.5 mm) package supports complex multi-channel interfaces while maintaining a surface-mount form factor.
• Flexible power domain: Core supply range from 770 mV to 970 mV supports integration with modern low-voltage power architectures.
• Extended-grade thermal range: Rated for 0 °C to 100 °C operation, suitable for systems requiring extended operating temperature performance.
• RoHS compliant: Meets common environmental compliance requirements for modern electronic assemblies.

Why Choose 1SG166HN2F43E2VG?

The 1SG166HN2F43E2VG delivers a combination of large logic capacity, extensive on-chip RAM, and a high pin count in a high-density FCBGA package — characteristics that simplify system-level integration for complex, high-performance designs. As a member of the Stratix® 10 GX family, it benefits from series-level innovations such as the Intel Hyperflex core architecture and advanced FinFET process technology to address demanding compute and bandwidth requirements.

This device is ideal for engineering teams building advanced networking, data center, telecommunication, or instrumentation systems that need scalable programmable fabric, significant embedded memory, and a compact, surface-mount package backed by RoHS compliance.

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