1SG166HN1F43I2VG

The Intel Stratix® 10 GX Field Programmable Gate Array 1SG166HN1F43I2VG is a high-capacity, industrial‑grade FPGA in a 1760‑BBGA FCBGA package. Built on the Stratix 10 GX family and leveraging the series’ Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process, this device is designed for bandwidth‑ and compute‑intensive applications that require large logic capacity, significant on‑chip memory, and extensive I/O.

Target markets include high‑performance networking, communications, and compute acceleration where deterministic performance, high-density logic (1,660,000 logic elements), and robust I/O (688 pins) are essential.

Key Features

• Core architecture  Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology provide the architectural foundation for improved core performance and efficiency as described for the Stratix 10 family.
• Logic capacity  1,660,000 logic elements, suitable for very large FPGA designs and complex custom logic implementations.
• On‑chip memory  125,829,120 total RAM bits of embedded memory; the Stratix 10 family uses M20K internal SRAM blocks for flexible memory banking and low‑latency storage.
• DSP and compute  Family features include variable‑precision DSP blocks and high raw compute capability for signal processing workloads (family datasheet describes up to multi‑TFLOP compute performance for Stratix 10 devices).
• I/O and transceivers  688 device I/O pins to support wide external interfacing; family transceiver features include high‑speed serial channels and transceiver performance up to the rates specified in the Stratix 10 GX/SX overview.
• Hard IP and interfaces  Stratix 10 family documentation highlights integrated hard IP such as PCI Express Gen3 and hardened Ethernet/PHY IP blocks for system integration.
• Power and supply  Operates from a core voltage supply range of 770 mV to 970 mV, consistent with the device’s high‑performance silicon requirements.
• Packaging and mounting  Surface‑mount 1760‑BBGA (1760‑FBGA, 42.5 × 42.5 mm) FCBGA package for high‑density board integration.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C and specified as Industrial grade.
• RoHS compliant  Device meets RoHS environmental requirements.

Typical Applications

• High‑performance networking  Use for packet processing, switching, and line‑card designs that need dense logic and large on‑chip memory.
• Data center acceleration  Ideal for FPGA‑based accelerators handling compute‑intensive workloads requiring large logic and DSP resources.
• High‑speed communications  Suitable for backplane and module designs leveraging the Stratix 10 family’s high‑speed transceiver and hardened IP capabilities.
• Signal processing and telecom  Deploy in PHY, FEC, and complex DSP pipelines where large memory and DSP throughput are required.

Unique Advantages

• Massive logic density: 1,660,000 logic elements enable consolidation of large designs onto a single device, reducing board count and system complexity.
• Extensive on‑chip memory: 125,829,120 total RAM bits support deep buffering, large LUTRAM usage, and high‑capacity data storage without external memory for many use cases.
• High I/O count: 688 I/O pins provide flexibility to connect multiple high‑speed interfaces and external peripherals directly to the FPGA.
• Industrial robustness: −40 °C to 100 °C operating range and industrial grade designation make the device suitable for demanding environmental conditions.
• Compact, high‑density package: 1760‑BBGA FCBGA (42.5 × 42.5 mm) supports dense PCB layouts while delivering the required signal density for large systems.
• Standards‑oriented family IP: Stratix 10 family hard IP elements (PCIe, Ethernet, memory controllers) simplify integration of common high‑throughput subsystems.

Why Choose 1SG166HN1F43I2VG?

The 1SG166HN1F43I2VG combines the Stratix 10 GX family’s advanced Hyperflex architecture and 14 nm process innovations with device‑level capacity—1,660,000 logic elements, more than 125 million bits of on‑chip RAM, and 688 I/O—to address demanding networking, communications, and acceleration designs. Its industrial temperature rating and RoHS compliance make it a durable choice for production systems that require both performance and reliability.

This device suits engineering teams building large, integration‑heavy FPGA systems that benefit from high logic density, extensive embedded memory, and the series‑level hardened IP and transceiver capabilities documented for the Stratix 10 GX family.

Request a quote or submit a sales inquiry to evaluate 1SG166HN1F43I2VG for your next high‑performance FPGA design.