1SG166HN1F43E2LG

The 1SG166HN1F43E2LG is an Intel Stratix® 10 GX field programmable gate array supplied in a 1760-BBGA (1760-FBGA, 42.5×42.5 mm) package. This extended-grade, surface-mount FPGA delivers 1,660,000 logic elements, 125,829,120 total RAM bits and 688 user I/Os for high-density, high-performance system designs.

Built on the Stratix 10 family architecture, the device combines advanced core technology, high I/O count and on-chip memory to address demanding applications in networking, compute acceleration and high-speed data processing while operating from a 820 mV–880 mV core supply and an operating range of 0 °C to 100 °C.

Key Features

• Core Logic — 1,660,000 logic elements provide large programmable fabric capacity for complex custom logic and datapaths.
• On‑device Memory — 125,829,120 total RAM bits for embedded buffering, packet processing and data staging.
• I/O and Package — 688 user I/Os in a 1760-BBGA (1760-FBGA, 42.5×42.5 mm) surface-mount package for high-density board integration.
• Family Innovations — Stratix 10 family characteristics such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate technology, enabling higher core performance and power efficiency (family-level attributes).
• High‑speed SerDes and IP (family features) — The Stratix 10 family supports heterogeneous 3D SiP transceiver tiles, multi-gigabit transceivers and hard IP including PCI Express and 10G Ethernet (refer to family datasheet for supported configurations).
• Supply and Thermal — Core voltage range 820 mV to 880 mV and extended-grade operating temperature range of 0 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑performance networking — Implement line cards, packet processing and high-speed switching that require large logic capacity, abundant on-chip RAM and many I/Os.
• Data center acceleration — Offload compute-intensive workloads and custom accelerators that benefit from large programmable fabric and embedded memory.
• Telecommunications equipment — Deploy in systems requiring multi‑lane transceiver integration and hard IP support as provided by the Stratix 10 family.

Unique Advantages

• High logic density: 1,660,000 logic elements enable implementation of large, complex FPGA designs without partitioning across multiple devices.
• Substantial on‑chip memory: 125,829,120 total RAM bits reduce dependence on external memory for buffering and dataflow management.
• Comprehensive I/O and packaging: 688 I/Os in a 1760-BBGA package support dense board-level connectivity and integration.
• Stratix 10 family technology: Access to family-level innovations—such as the Hyperflex core architecture and 14 nm tri-gate process—contributes to improved core performance and efficiency (see family datasheet for details).
• Extended-grade reliability: The extended-grade device and 0 °C to 100 °C operating range suit a wide set of commercial and telecom environments.
• Standards‑aware platform: Family-level hard IP blocks and high‑speed transceiver capabilities simplify implementation of standard interfaces used in networking and compute systems.

Why Choose 1SG166HN1F43E2LG?

This Stratix® 10 GX device positions itself for designs that demand large programmable fabric, abundant on-chip RAM and high I/O density in a single-package solution. Its extended-grade rating and family innovations provide a balanced combination of performance, integration and thermal tolerance for complex networking, data center and telecommunications applications.

Engineers seeking a high-capacity FPGA with family-proven architecture and extensive I/O capabilities will find the 1SG166HN1F43E2LG suitable for scalable, long‑lifecycle projects where integration and performance per watt are key considerations.

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