1SG165HU3F50E3VG

The 1SG165HU3F50E3VG is an Intel Stratix® 10 GX field programmable gate array packaged in a 2397-ball BGA (FCBGA) and supplied in a 2397-FBGA, FC (50×50) format. It delivers high logic capacity and large on-chip memory suited to designs that demand dense programmable logic, significant SRAM resources, and broad I/O connectivity.

As part of the Stratix 10 GX device family, this device benefits from family-level innovations described in the device overview, including the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology aimed at improved core performance and power efficiency for bandwidth- and compute-intensive applications.

Key Features

• Core / Architecture (family-level): Device belongs to the Stratix 10 GX family, which the device overview describes as using the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to increase core performance and power efficiency.
• Logic Capacity: 1,650,000 logic elements as specified for this part number, providing high-density programmable logic for complex designs.
• On-chip Memory: 119,537,664 total RAM bits, enabling large embedded buffering, packet buffering, and intermediate data storage without external memory in many use cases.
• I/O Density: 704 user I/O pins, supporting wide parallel interfaces and numerous high-speed links or peripheral connections.
• Family Transceiver and IP Capabilities (family-level): The Stratix 10 GX device overview documents high-speed transceiver and hard IP support (for example, PCI Express and 10G Ethernet in the device overview), useful for networking and computing systems.
• Power and Voltage: Core supply range specified at 770 mV to 970 mV for targeted power-domain design and supply planning.
• Package & Mounting: 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50). Surface mount type for compact PCB integration.
• Operating Range & Grade: Extended grade with an operating temperature range of 0 °C to 100 °C, matching thermally constrained board environments.
• Environmental Compliance: RoHS compliant.

Typical Applications

• High-bandwidth networking and switching: High logic density, large on-chip RAM, and extensive I/O make the device suitable for packet processing, switching fabrics, and line-card designs.
• Data center acceleration: Large logic and memory resources enable custom acceleration engines and in-line data processing for compute- and I/O-intensive workloads.
• Telecommunications infrastructure: Family-level transceiver and hard-IP capabilities combined with 704 I/O support enable protocol handling and backplane interfacing in telecom equipment.
• High-performance signal processing: Substantial embedded RAM and programmable logic capacity allow implementation of complex DSP pipelines and real-time data path processing.

Unique Advantages

• High logic density: 1,650,000 logic elements support large-scale, complex designs without partitioning across multiple devices.
• Large on-chip SRAM: 119,537,664 total RAM bits reduce dependence on external memory for buffering and intermediate storage, simplifying board-level memory architecture.
• Extensive I/O: 704 I/O pins provide broad connectivity for parallel interfaces, multiple high-speed links, and peripheral integration.
• Compact BGA packaging: 2397-ball FCBGA packaging enables dense PCB layouts while accommodating high I/O and thermal needs.
• Power-domain clarity: Defined core voltage range (770 mV–970 mV) supports precise power budgeting and regulator selection for low-voltage designs.
• Extended operational grade: Rated 0 °C to 100 °C for applications requiring extended commercial temperature performance.

Why Choose 1SG165HU3F50E3VG?

The 1SG165HU3F50E3VG is positioned for systems that require substantial programmable logic capacity, abundant on-chip RAM, and high I/O density in a compact BGA package. Its specification set supports development of complex networking, compute acceleration, and signal-processing designs where integration of large logic functions and memory close to I/O is critical.

Choosing this Stratix 10 GX device provides designers with a solution that aligns scalable logic resources and family-level high-speed interface capabilities with clear power and thermal parameters, supporting predictable system integration and long-term design scalability.

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