1SG165HU3F50I3VG

The 1SG165HU3F50I3VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397‑BBGA FCBGA package. It delivers large on‑chip resources and high I/O density for advanced, performance‑oriented applications.

Built on the Stratix 10 family architecture, this device targets high‑bandwidth, computation‑intensive systems where a combination of logic capacity, on‑chip RAM and high I/O count are required. Its industrial temperature grade and RoHS compliance make it suitable for demanding environments.

Key Features

• Logic Capacity  1,650,000 logic elements (LEs) to implement large, complex designs and custom processing pipelines.
• On‑Chip Memory  119,537,664 total RAM bits for deep buffering, large lookup tables, and memory‑intensive algorithms.
• I/O Density  704 I/O pins to support extensive peripheral connectivity, multi‑lane interfaces and high‑pin‑count board designs.
• Package & Mounting  2397‑BBGA (FCBGA) supplier package, 2397‑FBGA, FC (50×50) footprint; surface‑mount device for high‑density assemblies.
• Voltage Range  Core voltage supply range of 770 mV to 970 mV to match platform power domains and regulator designs.
• Operating Temperature  Industrial operating range from −40 °C to 100 °C for use in temperature‑challenging installations.
• Compliance  RoHS compliant for regulatory and environmental requirements.
• Stratix 10 Family Architecture  Leverages Stratix 10 family innovations such as the Intel Hyperflex core architecture and advanced FinFET process technology as described in family documentation.

Typical Applications

• High‑Performance Networking  Implement packet processing, protocol handling and custom switching logic using the device’s high logic capacity and abundant I/O.
• Data Center Accelerators  Deploy compute‑intensive accelerating functions and on‑chip buffers using the large RAM resource and dense logic fabric.
• Telecommunications & Backplane Systems  Support multi‑lane interfaces and system I/O requirements for backplane or board‑to‑board communications with 704 I/O pins.
• Signal Processing & DSP  Build real‑time processing chains and large custom DSP pipelines leveraging substantial logic and memory resources.

Unique Advantages

• Massive Logic Resource: 1,650,000 logic elements provide the headroom to implement complex, multi‑function systems on a single device.
• Large On‑Chip Memory: 119,537,664 bits of RAM enable deep buffering, state storage and large lookup tables without external memory dependency.
• High I/O Count: 704 I/O pins allow dense connectivity for multi‑lane interfaces, high‑speed peripherals and extensive system interconnect.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsher environmental conditions.
• Compact, High‑Density Package: 2397‑BBGA (FCBGA) packaging and 50×50 supplier footprint support high‑density PCB designs and surface‑mount assembly.
• Controlled Core Voltage Range: 770 mV–970 mV supply range aligns with modern low‑voltage power architectures for efficient board power design.

Why Choose 1SG165HU3F50I3VG?

The 1SG165HU3F50I3VG places large FPGA resources, substantial on‑chip memory and high I/O density into a single industrial‑grade FCBGA package. It is well suited for engineers building high‑bandwidth, compute‑heavy systems that require significant logic capacity and extensive external interfacing.

For designs that demand scalable logic, deep embedded RAM and rugged operating temperature performance, this Stratix 10 GX FPGA provides a clear platform option with family‑level architectural benefits documented in the Stratix 10 overview.

Request a quote or submit an inquiry for pricing and availability to evaluate the 1SG165HU3F50I3VG for your next high‑performance FPGA design.