1SG166HN1F43E1VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA

Quantity 91 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs207500Number of Logic Elements/Cells1660000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits125829120

Overview of 1SG166HN1F43E1VG – Stratix® 10 GX FPGA, 1,660,000 logic elements, 688 I/O

The 1SG166HN1F43E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 1760-BBGA FCBGA format. It delivers high core performance and system-level integration suited for bandwidth- and compute-intensive applications.

Built on the Stratix 10 family innovations, the device leverages the Intel Hyperflex core architecture and 14 nm process advancements to provide enhanced performance and power efficiency for networking, data center, high-speed I/O, and advanced signal-processing designs.

Key Features

  • Logic Capacity  Provides 1,660,000 logic elements to implement large-scale programmable logic and complex custom hardware functions.
  • Embedded Memory  Includes 125,829,120 total RAM bits for on-chip buffering, large state storage, and memory-intensive algorithms.
  • I/O and Package  Features 688 I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package with surface-mount mounting for dense board integration.
  • Voltage and Temperature  Core voltage supply range of 770 mV–970 mV and extended operating temperature range of 0°C–100°C to support deployment in warmer operating environments.
  • High-performance Architecture  Part of the Stratix 10 family with Intel Hyperflex core architecture, delivering increased core performance and improved power characteristics.
  • Transceiver and System IP (Family-level)  Stratix 10 family devices include high-speed transceiver technology and hardened system IP such as PCI Express and high-speed Ethernet (as documented for the family).
  • On-chip DSP and Memory Blocks (Family-level)  Family documentation describes variable-precision DSP blocks and large internal SRAM (M20K) blocks for compute and memory-intensive tasks.
  • Compliance  RoHS compliant for environmental and regulatory requirements.

Typical Applications

  • Networking and Telecom  Implements high-throughput packet processing, switching and custom protocol engines using abundant logic, large on-chip RAM, and high-speed transceiver support described for the Stratix 10 GX family.
  • Data Center Acceleration  Enables hardware acceleration and custom offload functions where large logic capacity and on-chip memory reduce latency and system bottlenecks.
  • High-Speed I/O and Backplane Interfaces  Supports designs that require many I/O and advanced transceiver features from the Stratix 10 GX family for chip-to-chip or backplane data transport.
  • Signal Processing and DSP  Suitable for variable-precision DSP workloads leveraging family-level DSP blocks and extensive internal memory for streaming and batch processing.

Unique Advantages

  • Substantial Logic Density:  1,660,000 logic elements enable implementation of large custom hardware accelerators and complex system functions on a single device.
  • Large On-Chip Memory:  125,829,120 bits of RAM reduce dependence on external memory for many buffering and stateful tasks, simplifying board-level memory architectures.
  • High I/O Count in Dense Package:  688 I/O in a 1760-BBGA (42.5 × 42.5 mm) package supports complex multi-lane interfaces and dense board routing requirements.
  • Family-Level High-Speed Capabilities:  Stratix 10 GX family features such as high-speed transceivers, hardened PCIe/ethernet IP, and Hyperflex architecture provide proven building blocks for high-bandwidth designs.
  • Extended Operating Range:  Extended grade with 0°C–100°C operating temperature supports deployment in warmer system environments without requiring industrial temperature grading.
  • Controlled Power Envelope:  Core supply range of 770 mV–970 mV enables predictable power budgeting and integration with system power rails.

Why Choose 1SG166HN1F43E1VG?

The 1SG166HN1F43E1VG positions as a high-capacity Stratix 10 GX FPGA well suited for engineers building bandwidth- and compute-focused systems. Its combination of 1,660,000 logic elements, substantial on-chip RAM, and high I/O count provides the resources required to integrate large custom logic, high-speed interfaces, and memory-hungry functions on a single device.

Backed by the Stratix 10 family design ecosystem and Intel documentation, this device offers a scalable platform for complex networking, data center acceleration, high-speed I/O, and advanced signal-processing applications where performance, integration, and predictable operating characteristics matter.

Request a quote or submit an inquiry for pricing and availability for the 1SG166HN1F43E1VG Stratix® 10 GX FPGA.

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