1SG166HN1F43I2LG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 827 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 207500 | Number of Logic Elements/Cells | 1660000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 125829120 |
Overview of 1SG166HN1F43I2LG – Stratix® 10 GX FPGA, 1.66M logic elements, 688 I/O, 1760-BBGA
The Intel Stratix® 10 GX FPGA 1SG166HN1F43I2LG is a high-capacity, industrial-grade programmable logic device designed for advanced bandwidth- and compute-intensive applications. It integrates Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology from the Stratix 10 family to address demanding processing and I/O requirements.
With 1,660,000 logic elements, 125,829,120 bits of on-chip RAM and 688 I/O pins in a 1760-BBGA FCBGA package, this device targets high-performance networking, data-center acceleration, and advanced signal-processing designs that require large logic capacity, substantial embedded memory, and robust high-speed connectivity.
Key Features
- Core & architecture Intel Hyperflex™ core architecture on 14 nm tri-gate (FinFET) process; family-level improvements include higher core performance and reduced power versus prior generations.
- Logic capacity 1,660,000 logic elements to implement large-scale custom logic, state machines and datapaths.
- On-chip memory 125,829,120 total RAM bits with M20K internal SRAM memory blocks for high-bandwidth, low-latency buffering and storage.
- I/O and package 688 user I/O in a surface-mount 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) for dense board-level connectivity.
- High-speed transceivers (family) Stratix 10 GX family supports heterogeneous 3D SiP transceiver tiles with up to 96 full-duplex channels and transceiver data rates up to 28.3 Gbps (family specification).
- Hard IP and interfaces (family) Includes family-level hard IP such as PCI Express® Gen3 x16, 10G Ethernet FEC, and hard memory controllers supporting DDR4 up to 2666 Mbps per pin.
- DSP and compute (family) Variable-precision DSP blocks and family-level DSP capabilities supporting high-throughput signal-processing workloads.
- Power and supply Core voltage supply range: 820 mV to 880 mV.
- Thermal and reliability Industrial operating temperature range from −40 °C to 100 °C; RoHS compliant.
Typical Applications
- High-performance networking Front-line and backplane switching, packet processing and line-rate protocol acceleration using large logic capacity and high-speed transceivers.
- Data-center acceleration Hardware offload for compute- or memory-intensive workloads leveraging abundant logic elements, on-chip RAM and hard PCIe interfaces.
- High-speed communications Board-to-board and module communication designs that require many I/O and multi-gigabit transceiver channels (family capability).
- Signal processing and DSP Real-time processing, filtering and multi-channel DSP applications utilizing the device’s embedded memory and variable-precision DSP blocks.
Unique Advantages
- Large programmable fabric: 1,660,000 logic elements enable implementation of extensive custom logic, multiple accelerator engines or complex protocol stacks on a single device.
- Substantial on-chip memory: 125.8 Mb of RAM supports deep buffering, on-chip databases and low-latency data paths without immediate external memory dependence.
- High I/O density and robust packaging: 688 I/O in a 1760-BBGA FCBGA package provides board-level routing flexibility for complex multi-interface designs.
- Designed for high-speed systems: Family-level support for multi-gigabit transceivers, PCIe Gen3 and Ethernet FEC simplifies integration into high-bandwidth architectures.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in temperature-demanding environments.
- Energy-optimized core: Narrow core supply window (820–880 mV) and 14 nm FinFET process characteristics contribute to efficient power-performance tradeoffs.
Why Choose 1SG166HN1F43I2LG?
The 1SG166HN1F43I2LG delivers a combination of high logic capacity, extensive embedded memory and dense I/O in an industrial-grade Stratix 10 GX device. It is positioned for designers who need scalable programmable resources, integrated high-speed interfaces and a robust thermal range for demanding applications.
This part is well suited to teams building high-bandwidth communications systems, data-center accelerators and advanced DSP platforms that benefit from the Stratix 10 family’s Hyperflex architecture, hard IP blocks and family-level transceiver performance. The device’s specifications make it a strong candidate where on-chip resources and industrial operating range are key procurement criteria.
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