1SG166HN1F43I2LG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA

Quantity 827 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs207500Number of Logic Elements/Cells1660000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits125829120

Overview of 1SG166HN1F43I2LG – Stratix® 10 GX FPGA, 1.66M logic elements, 688 I/O, 1760-BBGA

The Intel Stratix® 10 GX FPGA 1SG166HN1F43I2LG is a high-capacity, industrial-grade programmable logic device designed for advanced bandwidth- and compute-intensive applications. It integrates Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology from the Stratix 10 family to address demanding processing and I/O requirements.

With 1,660,000 logic elements, 125,829,120 bits of on-chip RAM and 688 I/O pins in a 1760-BBGA FCBGA package, this device targets high-performance networking, data-center acceleration, and advanced signal-processing designs that require large logic capacity, substantial embedded memory, and robust high-speed connectivity.

Key Features

  • Core & architecture  Intel Hyperflex™ core architecture on 14 nm tri-gate (FinFET) process; family-level improvements include higher core performance and reduced power versus prior generations.
  • Logic capacity  1,660,000 logic elements to implement large-scale custom logic, state machines and datapaths.
  • On-chip memory  125,829,120 total RAM bits with M20K internal SRAM memory blocks for high-bandwidth, low-latency buffering and storage.
  • I/O and package  688 user I/O in a surface-mount 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) for dense board-level connectivity.
  • High-speed transceivers (family)  Stratix 10 GX family supports heterogeneous 3D SiP transceiver tiles with up to 96 full-duplex channels and transceiver data rates up to 28.3 Gbps (family specification).
  • Hard IP and interfaces (family)  Includes family-level hard IP such as PCI Express® Gen3 x16, 10G Ethernet FEC, and hard memory controllers supporting DDR4 up to 2666 Mbps per pin.
  • DSP and compute (family)  Variable-precision DSP blocks and family-level DSP capabilities supporting high-throughput signal-processing workloads.
  • Power and supply  Core voltage supply range: 820 mV to 880 mV.
  • Thermal and reliability  Industrial operating temperature range from −40 °C to 100 °C; RoHS compliant.

Typical Applications

  • High-performance networking  Front-line and backplane switching, packet processing and line-rate protocol acceleration using large logic capacity and high-speed transceivers.
  • Data-center acceleration  Hardware offload for compute- or memory-intensive workloads leveraging abundant logic elements, on-chip RAM and hard PCIe interfaces.
  • High-speed communications  Board-to-board and module communication designs that require many I/O and multi-gigabit transceiver channels (family capability).
  • Signal processing and DSP  Real-time processing, filtering and multi-channel DSP applications utilizing the device’s embedded memory and variable-precision DSP blocks.

Unique Advantages

  • Large programmable fabric: 1,660,000 logic elements enable implementation of extensive custom logic, multiple accelerator engines or complex protocol stacks on a single device.
  • Substantial on-chip memory: 125.8 Mb of RAM supports deep buffering, on-chip databases and low-latency data paths without immediate external memory dependence.
  • High I/O density and robust packaging: 688 I/O in a 1760-BBGA FCBGA package provides board-level routing flexibility for complex multi-interface designs.
  • Designed for high-speed systems: Family-level support for multi-gigabit transceivers, PCIe Gen3 and Ethernet FEC simplifies integration into high-bandwidth architectures.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in temperature-demanding environments.
  • Energy-optimized core: Narrow core supply window (820–880 mV) and 14 nm FinFET process characteristics contribute to efficient power-performance tradeoffs.

Why Choose 1SG166HN1F43I2LG?

The 1SG166HN1F43I2LG delivers a combination of high logic capacity, extensive embedded memory and dense I/O in an industrial-grade Stratix 10 GX device. It is positioned for designers who need scalable programmable resources, integrated high-speed interfaces and a robust thermal range for demanding applications.

This part is well suited to teams building high-bandwidth communications systems, data-center accelerators and advanced DSP platforms that benefit from the Stratix 10 family’s Hyperflex architecture, hard IP blocks and family-level transceiver performance. The device’s specifications make it a strong candidate where on-chip resources and industrial operating range are key procurement criteria.

Request a quote or submit an inquiry to check pricing and availability for 1SG166HN1F43I2LG and to discuss volume needs or lead times.

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