1SG166HN2F43E1VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,347 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 207500 | Number of Logic Elements/Cells | 1660000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 125829120 |
Overview of 1SG166HN2F43E1VG – Stratix® 10 GX FPGA, 1,660,000 logic elements, 688 I/O
The Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) 1SG166HN2F43E1VG is a high-density, high-performance programmable device in a 1760-BBGA FCBGA package. Built on the Stratix 10 GX family architecture, the device leverages the Intel Hyperflex core architecture and Intel 14 nm tri-gate process innovations to address demanding bandwidth and compute workloads.
This device targets advanced applications that need large programmable fabric, abundant on-chip memory, and high I/O density—examples include communications and networking, data acceleration, and high-performance signal processing—while offering extended-grade operation and RoHS compliance for board-level integration.
Key Features
- Core Architecture Intel Stratix 10 GX family with the Hyperflex core architecture (series-level feature) implemented in a 14 nm tri-gate process for high-performance programmable logic.
- Logic Capacity 1,660,000 logic elements, providing large programmable fabric for complex custom logic and system integration.
- On-Chip Memory 125,829,120 total RAM bits to support large buffering, caching, and packet or data processing implementations.
- I/O Density 688 user I/O pins to enable wide parallel interfaces and dense external connectivity.
- Transceivers and Hard IP (series-level) Stratix 10 GX family features include high-speed transceivers and hard IP blocks such as PCI Express Gen3 and 10G Ethernet (series-level capabilities referenced in datasheet content).
- Power and Supply Core supply range from 770 mV to 970 mV, allowing designers to plan power delivery and sequencing around the specified voltage envelope.
- Package & Mounting 1760-BBGA, FCBGA package; supplier device package 1760-FBGA (42.5 × 42.5 mm). Surface-mount mounting type for standard PCB assembly.
- Temperature & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C.
- Environmental Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.
Typical Applications
- High‑Performance Networking Use the device’s large logic capacity and high I/O count to implement packet processing, switching logic, and protocol offload functions.
- Data Center Acceleration Deploy the FPGA fabric and on-chip memory for custom acceleration tasks, data movement, and protocol bridging that benefit from reconfigurability.
- Telecommunications Infrastructure Leverage series-level high-speed transceivers and hard IP to build PHY, fronthaul, and backplane interfaces in communications equipment.
- Advanced Signal Processing Apply the substantial RAM and logic resources for real-time DSP, modulation/demodulation, and other compute-heavy signal-processing pipelines.
Unique Advantages
- Large, Scalable Fabric: 1,660,000 logic elements enable implementation of complex algorithms and multiple subsystem integrations on a single device.
- Significant On‑Chip Memory: 125,829,120 bits of RAM reduce external memory dependency and simplify buffering for high-throughput designs.
- High I/O Count: 688 I/O pins support wide parallel buses and dense peripheral connectivity, reducing the need for external multiplexing logic.
- Series-Level High-Speed I/O and IP: Stratix 10 GX family features (as described in the datasheet) provide hard IP and transceiver options useful for PCIe, Ethernet, and high-rate links.
- Board-Level Integration Friendly: Surface-mount 1760-FBGA package (42.5 × 42.5 mm) and a defined core voltage range simplify PCB power delivery and mechanical planning.
- Compliance and Temperature Range: RoHS compliance and extended operating range (0 °C to 100 °C) support commercial and extended-environment deployments.
Why Choose 1SG166HN2F43E1VG?
The 1SG166HN2F43E1VG combines a substantial logic fabric with large on-chip memory and high I/O density in a compact 1760-BBGA package—making it well suited for system designs that require high integration and programmable flexibility. Its placement within the Intel Stratix 10 GX family brings series-level architectural advantages such as the Hyperflex core and high-speed I/O capabilities referenced in the device overview.
This device is appropriate for engineering teams building advanced networking, compute-acceleration, and signal-processing solutions who need a scalable, high-capacity FPGA backed by documented family-level features and extended-grade operation for reliable deployment.
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