1SG166HN2F43E1VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA

Quantity 1,347 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs207500Number of Logic Elements/Cells1660000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits125829120

Overview of 1SG166HN2F43E1VG – Stratix® 10 GX FPGA, 1,660,000 logic elements, 688 I/O

The Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) 1SG166HN2F43E1VG is a high-density, high-performance programmable device in a 1760-BBGA FCBGA package. Built on the Stratix 10 GX family architecture, the device leverages the Intel Hyperflex core architecture and Intel 14 nm tri-gate process innovations to address demanding bandwidth and compute workloads.

This device targets advanced applications that need large programmable fabric, abundant on-chip memory, and high I/O density—examples include communications and networking, data acceleration, and high-performance signal processing—while offering extended-grade operation and RoHS compliance for board-level integration.

Key Features

  • Core Architecture  Intel Stratix 10 GX family with the Hyperflex core architecture (series-level feature) implemented in a 14 nm tri-gate process for high-performance programmable logic.
  • Logic Capacity  1,660,000 logic elements, providing large programmable fabric for complex custom logic and system integration.
  • On-Chip Memory  125,829,120 total RAM bits to support large buffering, caching, and packet or data processing implementations.
  • I/O Density  688 user I/O pins to enable wide parallel interfaces and dense external connectivity.
  • Transceivers and Hard IP (series-level)  Stratix 10 GX family features include high-speed transceivers and hard IP blocks such as PCI Express Gen3 and 10G Ethernet (series-level capabilities referenced in datasheet content).
  • Power and Supply  Core supply range from 770 mV to 970 mV, allowing designers to plan power delivery and sequencing around the specified voltage envelope.
  • Package & Mounting  1760-BBGA, FCBGA package; supplier device package 1760-FBGA (42.5 × 42.5 mm). Surface-mount mounting type for standard PCB assembly.
  • Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
  • Environmental Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

  • High‑Performance Networking  Use the device’s large logic capacity and high I/O count to implement packet processing, switching logic, and protocol offload functions.
  • Data Center Acceleration  Deploy the FPGA fabric and on-chip memory for custom acceleration tasks, data movement, and protocol bridging that benefit from reconfigurability.
  • Telecommunications Infrastructure  Leverage series-level high-speed transceivers and hard IP to build PHY, fronthaul, and backplane interfaces in communications equipment.
  • Advanced Signal Processing  Apply the substantial RAM and logic resources for real-time DSP, modulation/demodulation, and other compute-heavy signal-processing pipelines.

Unique Advantages

  • Large, Scalable Fabric:  1,660,000 logic elements enable implementation of complex algorithms and multiple subsystem integrations on a single device.
  • Significant On‑Chip Memory:  125,829,120 bits of RAM reduce external memory dependency and simplify buffering for high-throughput designs.
  • High I/O Count:  688 I/O pins support wide parallel buses and dense peripheral connectivity, reducing the need for external multiplexing logic.
  • Series-Level High-Speed I/O and IP:  Stratix 10 GX family features (as described in the datasheet) provide hard IP and transceiver options useful for PCIe, Ethernet, and high-rate links.
  • Board-Level Integration Friendly:  Surface-mount 1760-FBGA package (42.5 × 42.5 mm) and a defined core voltage range simplify PCB power delivery and mechanical planning.
  • Compliance and Temperature Range:  RoHS compliance and extended operating range (0 °C to 100 °C) support commercial and extended-environment deployments.

Why Choose 1SG166HN2F43E1VG?

The 1SG166HN2F43E1VG combines a substantial logic fabric with large on-chip memory and high I/O density in a compact 1760-BBGA package—making it well suited for system designs that require high integration and programmable flexibility. Its placement within the Intel Stratix 10 GX family brings series-level architectural advantages such as the Hyperflex core and high-speed I/O capabilities referenced in the device overview.

This device is appropriate for engineering teams building advanced networking, compute-acceleration, and signal-processing solutions who need a scalable, high-capacity FPGA backed by documented family-level features and extended-grade operation for reliable deployment.

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