1SG166HN2F43I2LG

The 1SG166HN2F43I2LG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) IC offering 1,660,000 logic elements in a 1760-BBGA (FCBGA) package. Built on the Stratix 10 family architecture, it targets high-performance, bandwidth- and compute-intensive applications where large logic capacity, extensive on-chip RAM and robust I/O are required.

This device combines the Stratix 10 family innovations with industrial-grade operation and a compact 1760-FBGA (42.5×42.5 mm) supplier package, delivering a platform for demanding embedded, communications and compute designs.

Key Features

• Core Architecture  The device is part of the Intel Stratix 10 GX family and leverages the family’s core architecture innovations for high-performance programmable logic.
• Logic Capacity  1,660,000 logic elements providing extensive fabric resources for complex logic and custom hardware acceleration.
• On-chip Memory  125,829,120 total RAM bits to support large buffering, state storage and memory-intensive algorithms.
• I/O and Package  688 user I/Os in a 1760-BBGA (FCBGA) package; supplier device package specified as 1760-FBGA (42.5×42.5 mm) and designed for surface-mount assembly.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV for the device core.
• Temperature and Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Device Management and Security  Stratix 10 family documentation includes device configuration and Secure Device Manager (SDM) features for configuration and management.

Typical Applications

• High-performance Networking  Use in network switches, routers and line cards where large logic capacity and abundant on-chip RAM support packet processing and buffering.
• Data Center Acceleration  Suitable for compute acceleration and custom data-path implementations that require significant programmable logic and memory resources.
• Telecommunications  For front-end processing, protocol handling and high-bandwidth interfaces where extensive I/O and logic density are needed.
• Embedded Signal Processing  Implement complex DSP pipelines and large state machines using the device’s logic and memory resources.

Unique Advantages

• High logic density: 1,660,000 logic elements enable large-scale designs and complex hardware implementations without immediate partitioning across multiple devices.
• Significant on-chip memory: 125,829,120 RAM bits reduce dependence on external memory for buffering and accelerate data-path operations.
• Robust I/O and package: 688 I/Os in a 1760-BBGA package provide wide connectivity and a compact footprint for system integration.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Optimized core power range: Core supply of 0.82–0.88 V supports board-level power planning and efficient core operation.
• Stratix 10 family innovations: Benefits from the Stratix 10 series engineering and features documented for the family, including architecture and device management capabilities.

Why Choose 1SG166HN2F43I2LG?

The 1SG166HN2F43I2LG positions itself for designs that demand substantial programmable logic capacity, large on-chip memory and extensive I/O in an industrial-grade FPGA. Its 1760-BBGA package and surface-mount mounting type make it suitable for dense board layouts where a high resource FPGA is required.

Choose this Stratix 10 GX device when your project requires scalable logic and memory resources, predictable industrial temperature operation, and the architectural benefits of the Stratix 10 family for advanced communication, compute and embedded applications.

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