1SG166HN3F43E1VG

The 1SG166HN3F43E1VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) IC in a 1760‑BBGA (FCBGA) package. It delivers high logic density and on‑chip RAM for demanding, high‑performance applications and is part of the Stratix 10 GX family, which incorporates the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) technology.

Designed for surface‑mount deployment, this device targets applications requiring large numbers of logic elements, extensive I/O, and substantial embedded memory while operating across an extended temperature range.

Key Features

• Core and Architecture  Member of the Intel Stratix 10 GX family, leveraging the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology as described for the device family.
• Logic Density  1,660,000 logic elements, enabling complex logic implementations and high design integration.
• Embedded Memory  125,829,120 total RAM bits of on‑chip memory to support large buffering, state storage, and data processing functions.
• I/O Capacity  688 I/O pins to support broad peripheral interfacing and high‑pin‑count system designs.
• Package & Mounting  1760‑BBGA (FCBGA) surface mount package; supplier device package listed as 1760‑FBGA (42.5 × 42.5 mm) for PCB footprint planning.
• Power  Supported core voltage supply range from 770 mV to 970 mV to match platform power delivery and sequencing requirements.
• Operating Range & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for deployment in thermally demanding environments.
• Compliance  RoHS compliant for regulated lead‑free use and assembly.
• Family‑level Capabilities  Stratix 10 GX family innovations include high core performance, heterogeneous 3D SiP transceiver tiles, fractional synthesis PLLs, and hard IP blocks for high‑speed interfaces (described at the family level in product documentation).

Typical Applications

• High‑performance networking and switching  Leverages extensive I/O and the Stratix 10 GX family’s high‑bandwidth architecture to implement packet processing, forwarding, and network acceleration functions.
• Data center acceleration  High logic density and large embedded RAM enable custom acceleration engines, protocol offload, and data buffering.
• High‑speed communications  Used where substantial I/O and family‑level transceiver and PLL capabilities are required for backplane and chip‑to‑chip interfaces.
• Signal processing and DSP  Large logic and memory resources support variable‑precision DSP implementations and complex dataflow pipelines.

Unique Advantages

• High logic capacity:  1,660,000 logic elements provide the silicon real estate to consolidate functions and reduce external logic.
• Substantial embedded memory:  125,829,120 RAM bits support deep buffering and large on‑chip data structures, lowering external memory dependence.
• Extensive I/O count:  688 I/O pins enable high‑density interfacing to peripherals, mezzanine cards, and system connectors.
• Robust package and PCB compatibility:  1760‑FBGA (42.5 × 42.5 mm) footprint and surface‑mount construction streamline board integration for complex designs.
• Flexible power window:  Core voltage support from 770 mV to 970 mV accommodates platform power architectures and sequencing strategies.
• Extended temperature grade:  Rated 0 °C to 100 °C for reliable operation across typical industrial and data‑center thermal conditions.
• Regulatory readiness:  RoHS compliance supports lead‑free assembly and global environmental requirements.

Why Choose 1SG166HN3F43E1VG?

The 1SG166HN3F43E1VG delivers a combination of very high logic element count, large on‑chip memory, and broad I/O capacity in a single Stratix 10 GX package. Those attributes make it well suited for customers building high‑performance network, data‑center, and signal‑processing systems that require dense programmable logic and substantial local RAM.

As a member of the Stratix 10 GX family, this device benefits from family‑level architectural innovations such as the Intel Hyperflex core architecture and advanced 14 nm process technology, offering a platform that scales with complex system requirements while fitting into standard surface‑mount, FCBGA‑based board designs.

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