1SG166HN2F43I1VG

The 1SG166HN2F43I1VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) supplied in a 1760-BBGA FCBGA package. It is built on the Stratix 10 family architecture and targets high-performance, bandwidth-intensive applications that require large logic capacity, abundant I/O, and embedded memory resources.

Designed for industrial-grade deployments, this device combines Intel Hyperflex core architecture innovations (as documented for the Stratix 10 family) with a high I/O count and substantial on-chip RAM to support communications, networking, high-performance compute, and advanced signal-processing designs.

Key Features

• Logic Capacity  1,660,000 logic elements to implement large, complex designs and high-density FPGA functions.
• Embedded Memory  125,829,120 total RAM bits of on-chip memory to support buffering, large lookup tables, and state storage.
• I/O and Connectivity  688 general-purpose I/O pins provide flexible interfacing to high-pin-count systems and peripherals.
• Advanced Architecture (Family-level)  Built on the Stratix 10 family innovations including the Intel Hyperflex core architecture and 14 nm FinFET technology, enabling high core performance and efficiency as described in the device overview.
• High-speed Transceiver Support (Family-level)  Stratix 10 family documentation includes heterogeneous 3D SiP transceiver tiles and transceiver performance up to 28.3 Gbps for demanding serial-link applications.
• Package  1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) ball-grid array for high-density board-level integration.
• Power and Voltage  Core supply range of 770 mV to 970 mV to match system power architectures and support low-voltage operation.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for reliable use in industrial environments.
• Reliability and Security (Family-level)  Stratix 10 device documentation includes features for device configuration, secure device manager, and SEU detection and correction mechanisms for system reliability.

Typical Applications

• High-performance Networking  Implements packet processing, switching, and protocol acceleration where large logic capacity and high I/O are required.
• Data Center Acceleration  Serves as FPGA acceleration for compute and storage tasks that leverage extensive on-chip RAM and dense logic resources.
• Telecommunications and Backplane Systems  Enables high-speed serial interfaces and complex PHY/MAC implementations, leveraging Stratix 10 family transceiver capabilities.
• Test, Measurement and Broadcast  Handles high-throughput signal processing and real-time data handling using the device’s memory and logic resources.

Unique Advantages

• Large Logic Footprint: 1.66 million logic elements let you consolidate functions that might otherwise require multiple devices, reducing BOM and board complexity.
• Significant On‑Chip Memory: 125,829,120 bits of RAM facilitate large buffers, LUT-based functions, and stateful processing without external memory for many use cases.
• High Pin Count for System Integration: 688 I/O pins provide the routing density needed for complex interfaces, parallel buses, and multi-channel systems.
• Industrial-Grade Thermal Range: −40 °C to 100 °C rating supports deployment in industrial environments where wider temperature tolerance is required.
• High-density BBGA Package: 1760-ball FCBGA (42.5 × 42.5 mm) offers a compact, high-pin-count solution for space-constrained, high-performance boards.
• Low-voltage Core Operation: 770 mV–970 mV supply range enables compatibility with modern low-voltage power rails and efficient power delivery.

Why Choose 1SG166HN2F43I1VG?

The 1SG166HN2F43I1VG positions itself for systems requiring a combination of substantial logic density, abundant on-chip RAM, and high I/O capacity within an industrial temperature envelope. It is suitable for designers consolidating complex algorithms, packet-processing pipelines, or large-scale signal-processing blocks into a single Stratix 10 GX FPGA.

Backed by the Stratix 10 family architecture and documented features such as the Hyperflex core innovations and high-speed transceiver support, this device offers a scalable platform for long-term designs where performance, integration, and reliability are key considerations.

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