1SG166HN2F43I2VGAS

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA

Quantity 1,039 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs207500Number of Logic Elements/Cells1660000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits125829120

Overview of 1SG166HN2F43I2VGAS – Stratix® 10 GX FPGA, 1,660,000 logic elements, 688 I/Os, 1760-BBGA

The 1SG166HN2F43I2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package intended for industrial-grade, high-performance programmable designs. Built on the Stratix 10 family architecture, this device targets advanced applications that require dense logic, large on-chip RAM, high-speed transceivers and comprehensive I/O.

Key value propositions include a large logic fabric, significant embedded RAM, integrated high-speed serial capability, and industry-grade operating range—providing a platform for high-bandwidth communications, compute-intensive processing and complex system integration.

Key Features

  • Core architecture  Intel Stratix 10 family features, including the Intel Hyperflex core architecture as described for the Stratix 10 GX/SX device family, delivering increased core performance compared to previous-generation high-performance FPGAs.
  • Logic capacity  1,660,000 logic elements (LEs) to implement large, complex designs and multi-function systems on a single device.
  • Embedded memory  125,829,120 total RAM bits of on-chip memory to support large buffers, lookup tables and on-chip storage; includes M20K internal SRAM memory blocks as noted for the family.
  • High-speed DSP and compute  Variable precision DSP blocks and documented family-level compute capabilities suitable for intensive signal processing and algorithm acceleration.
  • Transceivers & serial I/O  Family-level transceiver capabilities include high-speed channels with data rates up to 28.3 Gbps and heterogeneous 3D SiP transceiver tiles described for Stratix 10 devices.
  • Hard IP options  Family documentation cites hard PCI Express Gen3 and hard 10G Ethernet FEC capabilities in the Stratix 10 family.
  • General I/O and package  688 I/O pins in a 1760-BBGA, FCBGA package (supplier device package: 1760-FBGA (42.5×42.5)) for dense board-level connectivity and signal routing.
  • Power and operating range  Core voltage supply range 770 mV to 970 mV; industrial operating temperature range −40 °C to 100 °C.
  • Mounting and compliance  Surface mount device, RoHS compliant.

Typical Applications

  • High-speed communications  Backplane and line-card designs that require multi-gigabit serial links and protocol offload using the device's high-speed transceivers and hard IP options.
  • Network and packet processing  Packet inspection, routing and acceleration functions that benefit from dense logic, large on-chip RAM and DSP resources.
  • Data center acceleration  Custom compute and data-path acceleration where large logic capacity and onboard memory reduce the need for external components.
  • Advanced signal processing  Real-time DSP, modulation/demodulation and high-throughput algorithm implementations using variable precision DSP blocks and extensive local RAM.

Unique Advantages

  • Highly integrated logic and memory: Large logic fabric (1,660,000 LEs) combined with 125,829,120 RAM bits reduces external component count and simplifies board-level design.
  • High-speed serial capability: Family-level transceiver data rates up to 28.3 Gbps and heterogeneous transceiver tiles enable high-bandwidth links for modern communication systems.
  • Industrial operating range: −40 °C to 100 °C rating supports deployments where extended temperature tolerance is required.
  • Dense I/O and compact package: 688 I/Os in a 1760-BBGA package (1760-FBGA (42.5×42.5)) delivers high pin count in a compact footprint for complex board layouts.
  • Controlled core power envelope: Core supply range of 770 mV to 970 mV enables predictable power budgeting for system designs.

Why Choose 1SG166HN2F43I2VGAS?

1SG166HN2F43I2VGAS positions itself as a high-capacity, industrial-grade Stratix 10 GX FPGA that combines a very large logic fabric, substantial on-chip RAM and family-level high-speed serial and hard IP features. It is suitable for engineers building advanced communications, compute acceleration and signal-processing systems that require significant on-chip resources and reliable operation across a wide temperature range.

Selecting this device provides a clear upgrade path within the Stratix 10 device family and access to the device family’s documented architecture and capabilities, enabling scalable designs that leverage the documented Hyperflex core architecture, high-speed transceivers and integrated memory and DSP resources.

Request a quote or submit an inquiry for 1SG166HN2F43I2VGAS to receive pricing, availability and assistance tailored to your design and volume needs.

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