1SG166HN2F43I2VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,039 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 207500 | Number of Logic Elements/Cells | 1660000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 125829120 |
Overview of 1SG166HN2F43I2VGAS – Stratix® 10 GX FPGA, 1,660,000 logic elements, 688 I/Os, 1760-BBGA
The 1SG166HN2F43I2VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package intended for industrial-grade, high-performance programmable designs. Built on the Stratix 10 family architecture, this device targets advanced applications that require dense logic, large on-chip RAM, high-speed transceivers and comprehensive I/O.
Key value propositions include a large logic fabric, significant embedded RAM, integrated high-speed serial capability, and industry-grade operating range—providing a platform for high-bandwidth communications, compute-intensive processing and complex system integration.
Key Features
- Core architecture Intel Stratix 10 family features, including the Intel Hyperflex core architecture as described for the Stratix 10 GX/SX device family, delivering increased core performance compared to previous-generation high-performance FPGAs.
- Logic capacity 1,660,000 logic elements (LEs) to implement large, complex designs and multi-function systems on a single device.
- Embedded memory 125,829,120 total RAM bits of on-chip memory to support large buffers, lookup tables and on-chip storage; includes M20K internal SRAM memory blocks as noted for the family.
- High-speed DSP and compute Variable precision DSP blocks and documented family-level compute capabilities suitable for intensive signal processing and algorithm acceleration.
- Transceivers & serial I/O Family-level transceiver capabilities include high-speed channels with data rates up to 28.3 Gbps and heterogeneous 3D SiP transceiver tiles described for Stratix 10 devices.
- Hard IP options Family documentation cites hard PCI Express Gen3 and hard 10G Ethernet FEC capabilities in the Stratix 10 family.
- General I/O and package 688 I/O pins in a 1760-BBGA, FCBGA package (supplier device package: 1760-FBGA (42.5×42.5)) for dense board-level connectivity and signal routing.
- Power and operating range Core voltage supply range 770 mV to 970 mV; industrial operating temperature range −40 °C to 100 °C.
- Mounting and compliance Surface mount device, RoHS compliant.
Typical Applications
- High-speed communications Backplane and line-card designs that require multi-gigabit serial links and protocol offload using the device's high-speed transceivers and hard IP options.
- Network and packet processing Packet inspection, routing and acceleration functions that benefit from dense logic, large on-chip RAM and DSP resources.
- Data center acceleration Custom compute and data-path acceleration where large logic capacity and onboard memory reduce the need for external components.
- Advanced signal processing Real-time DSP, modulation/demodulation and high-throughput algorithm implementations using variable precision DSP blocks and extensive local RAM.
Unique Advantages
- Highly integrated logic and memory: Large logic fabric (1,660,000 LEs) combined with 125,829,120 RAM bits reduces external component count and simplifies board-level design.
- High-speed serial capability: Family-level transceiver data rates up to 28.3 Gbps and heterogeneous transceiver tiles enable high-bandwidth links for modern communication systems.
- Industrial operating range: −40 °C to 100 °C rating supports deployments where extended temperature tolerance is required.
- Dense I/O and compact package: 688 I/Os in a 1760-BBGA package (1760-FBGA (42.5×42.5)) delivers high pin count in a compact footprint for complex board layouts.
- Controlled core power envelope: Core supply range of 770 mV to 970 mV enables predictable power budgeting for system designs.
Why Choose 1SG166HN2F43I2VGAS?
1SG166HN2F43I2VGAS positions itself as a high-capacity, industrial-grade Stratix 10 GX FPGA that combines a very large logic fabric, substantial on-chip RAM and family-level high-speed serial and hard IP features. It is suitable for engineers building advanced communications, compute acceleration and signal-processing systems that require significant on-chip resources and reliable operation across a wide temperature range.
Selecting this device provides a clear upgrade path within the Stratix 10 device family and access to the device family’s documented architecture and capabilities, enabling scalable designs that leverage the documented Hyperflex core architecture, high-speed transceivers and integrated memory and DSP resources.
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