1SG166HN3F43E2VG

The 1SG166HN3F43E2VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760‑BBGA (1760‑FBGA, 42.5×42.5) package. This extended‑grade, surface‑mount FPGA combines high logic density, substantial on‑chip memory, and a large I/O complement for demanding bandwidth and processing applications.

As part of the Stratix 10 GX family, the device leverages family innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate technology to address high‑performance networking, compute acceleration, and high‑speed serial communications use cases.

Key Features

• Logic Capacity  1,660,000 logic elements provide significant programmable fabric for complex algorithms and large custom logic designs.
• On‑chip Memory  125,829,120 total RAM bits deliver large embedded storage for buffering, lookup tables, and state retention within the FPGA fabric.
• I/O Density  688 I/O pins support extensive external connectivity for high‑pin‑count systems and multi‑lane interfaces.
• High‑Performance Architecture (Family)  Built on the Intel Hyperflex core architecture and 14 nm tri‑gate technology, the Stratix 10 GX family is designed for increased core performance and power efficiency.
• Transceiver and IP Features (Family)  Stratix 10 GX family documentation highlights high‑speed transceiver and hard IP options (PCIe, Ethernet, Interlaken) suitable for high‑bandwidth applications.
• Power Supply  Operating core voltage range of 770 mV to 970 mV aligns with low‑voltage, high‑performance FPGA power domains.
• Package and Mounting  1760‑BBGA, FCBGA (supplier package: 1760‑FBGA, 42.5×42.5) surface‑mount package for compact, board‑level integration.
• Extended Temperature Grade  Rated for 0 °C to 100 °C operation to meet a range of commercial and industrial ambient conditions.
• Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Large logic capacity and high I/O count enable implementation of line‑rate packet processing, forwarding engines, and protocol offload.
• Data Center Acceleration  Substantial on‑chip memory and programmable fabric support custom accelerators, packet analytics, and hardware offloads.
• High‑Speed Serial Communications  Family transceiver and hard IP features in the Stratix 10 GX family make the device suitable for multi‑lane serial links and backplane interfaces.
• Signal Processing and DSP  Large logic and memory resources allow for implementation of complex DSP pipelines and fixed/floating‑point processing blocks described at the family level.

Unique Advantages

• High logic density: 1,660,000 logic elements enable integration of large, system‑level functions into a single FPGA.
• Substantial on‑chip memory: 125,829,120 total RAM bits reduce dependence on external memory for buffering and data staging.
• Extensive I/O: 688 I/O pins provide the connectivity needed for multi‑interface designs and high‑pin‑count peripherals.
• Advanced package options: 1760‑FBGA (42.5×42.5) package supports dense board designs while providing the pin count required by complex systems.
• Extended operating range: Extended grade with 0 °C to 100 °C operation supports a wide set of deployment environments.
• Family‑level architectural improvements: Leveraging the Hyperflex core architecture and 14 nm tri‑gate process provides measurable core performance and efficiency advantages at the family level.

Why Choose 1SG166HN3F43E2VG?

The 1SG166HN3F43E2VG delivers a combination of high logic capacity, abundant on‑chip memory, and a large I/O count in a compact 1760‑FBGA package, making it well suited for designers building high‑bandwidth networking, data center acceleration, and advanced signal processing systems. As a member of the Intel Stratix 10 GX family, it benefits from family innovations such as the Intel Hyperflex core architecture and the high‑performance feature set documented for Stratix 10 GX devices.

This device is aimed at projects that require scalable programmable fabric, integrated memory resources, and substantial I/O while operating within an extended temperature range and low core voltage window.

Request a quote or contact sales to discuss availability, pricing, and how 1SG166HN3F43E2VG fits your next high‑performance FPGA design.