1SG166HN3F43E3XG

The 1SG166HN3F43E3XG is an Intel Stratix® 10 GX family FPGA optimized for high-performance, high-bandwidth applications. It leverages the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process to deliver a high-density programmable fabric suitable for demanding compute and I/O-centric designs.

This device provides a large logic capacity, substantial on-chip RAM, and a broad I/O complement in a surface-mount 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package, making it appropriate for advanced networking, compute acceleration, and high-speed communications systems that require performance, integration, and extended temperature operation.

Key Features

• Core & architecture  Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) process technology as part of the Stratix® 10 GX family, offering a modern, high-performance FPGA fabric.
• Logic capacity  1,660,000 logic elements for large-scale logic implementation and complex algorithm mapping.
• On-chip memory  125,829,120 total RAM bits to support large buffers, FIFOs, and data-path storage directly in the FPGA fabric.
• I/O and high-speed interfaces  688 user I/O pins to accommodate wide parallel interfaces and multiple high-speed serial connections; series documentation highlights high-performance transceiver capabilities suited to backplane and module communication.
• Package & mounting  Surface-mount 1760-BBGA (supplier package: 1760-FBGA, 42.5 × 42.5 mm) for compact, board-level integration in dense systems.
• Power supply  Core voltage supply range 820 mV to 880 mV for the device core domain, enabling designers to plan power delivery and budgeting precisely.
• Thermal & grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for applications that require above-commercial temperature tolerance.
• Reliability & device management  Series-level features include device configuration, secure device management, and single-event upset detection and correction mechanisms as documented for Stratix® 10 devices.
• Standards compliance  RoHS compliant, supporting environmental and manufacturing process requirements.

Typical Applications

• High-performance networking and switching  Implement packet processing, switching fabrics, and PHY/interface aggregation using the device's large logic capacity and extensive I/O.
• Compute acceleration and FPGA offload  Map custom acceleration kernels and data-paths into the fabric and on-chip RAM for latency-sensitive compute tasks.
• High-speed serial communications  Use the device's I/O complement and series transceiver capabilities for backplane, module, and chip-to-chip high-throughput links.
• Advanced DSP and signal processing  Deploy complex signal chains and pipeline structures using the high logic density and substantial internal RAM for buffering and intermediate data storage.

Unique Advantages

• Large programmable fabric: 1,660,000 logic elements enable extensive custom logic and IP integration on a single device, reducing system-level part count.
• Significant on-chip memory: 125,829,120 RAM bits support large buffers and data-path storage, minimizing external memory traffic and latency.
• Broad I/O count: 688 I/O pins provide flexibility for wide parallel interfaces and multiple serial lanes, simplifying board-level routing and system partitioning.
• Compact, production-ready packaging: 1760-FBGA (42.5 × 42.5 mm) surface-mount package balances high pin count with board real estate efficiency.
• Engineered for demanding environments: Extended-grade operation from 0 °C to 100 °C supports deployments that exceed standard commercial temperature ranges.
• Power domain clarity: Defined core supply range (820–880 mV) helps streamline power delivery design and thermal planning.

Why Choose 1SG166HN3F43E3XG?

The 1SG166HN3F43E3XG delivers a high-density Stratix® 10 GX FPGA option for system designers who need large logic capacity, substantial on-chip RAM, and extensive I/O in a single, surface-mount package. Its inclusion in the Stratix® 10 family brings the modern Hyperflex core architecture and 14 nm process benefits to applications demanding high bandwidth and complex processing.

This part is well suited to teams developing advanced networking, compute acceleration, and high-speed communications products that require scalability, robust device management features, and support for extended temperature operation. Its combination of logic, memory, and I/O density provides long-term design flexibility within Intel’s Stratix® 10 device ecosystem.

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