1SG166HN3F43I2VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 1660000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,103 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 207500 | Number of Logic Elements/Cells | 1660000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 125829120 |
Overview of 1SG166HN3F43I2VG – Stratix® 10 GX FPGA, 1,660,000 logic elements, 688 I/O, 1760-BBGA
The 1SG166HN3F43I2VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a high-density 1760-BBGA/FCBGA package. It provides a large logic fabric and substantial on-chip memory with an industrial operating temperature range for demanding, performance-oriented designs.
As part of the Stratix 10 GX family, the device benefits from family-level innovations such as the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology, delivering the performance and integration expected for advanced processing and high-bandwidth interface applications.
Key Features
- Core and Architecture Built on Stratix 10 GX family architecture with Intel Hyperflex core innovations noted in the device overview.
- Logic Capacity 1,660,000 logic elements to implement large-scale programmable logic and complex custom functions.
- Embedded Memory 125,829,120 total RAM bits for on-chip buffering, lookup tables, and state storage.
- I/O and Interfaces 688 I/O pins to support wide parallel interfaces and high-pin-count board-level connectivity.
- Power Core voltage supply range 770 mV to 970 mV for device power rail planning and design integration.
- Temperature and Grade Industrial grade with operating temperature range −40 °C to 100 °C for deployment in temperature-challenging environments.
- Package and Mounting Surface-mount package in 1760-BBGA, FCBGA format; supplier device package shown as 1760-FBGA (42.5 × 42.5 mm) for PCB footprint and thermal considerations.
- Standards and Compliance RoHS compliant to support regulatory-driven product builds and material selection.
Typical Applications
- High-bandwidth Networking and Telecom Large logic capacity and high I/O count support implementation of advanced packet processing, line cards, and switching functions where throughput and interface density matter.
- Compute Acceleration Significant embedded RAM and logic resources enable offload and acceleration of compute kernels and custom data-paths within high-performance systems.
- Embedded Systems with SoC Integration As a member of the Stratix 10 family, it aligns with designs leveraging family-level SoC capabilities and hard IP for system-level integration in embedded applications.
- Storage and PCIe-based Systems Family-level support for hardened protocol IP and high-speed serial links makes the device suitable for custom controller and interface logic in storage subsystems.
Unique Advantages
- High Logic Density: 1,660,000 logic elements provide headroom for complex RTL, large state machines, and wide datapaths.
- Substantial On-Chip Memory: 125,829,120 bits of RAM allow extensive buffering and table storage without immediate dependence on external memory.
- Extensive I/O: 688 I/O pins enable flexible board partitioning, multiple parallel interfaces, and high pin-count peripherals.
- Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in environments with wider thermal swings.
- Compact, High-Density Package: 1760-BBGA/FCBGA (1760-FBGA 42.5 × 42.5 mm) package balances high integration with a defined PCB footprint for thermal and routing planning.
- Regulatory Compliance: RoHS compliance simplifies material selection and supports regulatory requirements for many markets.
Why Choose 1SG166HN3F43I2VG?
This Stratix 10 GX FPGA part delivers a combination of high logic capacity, abundant on-chip memory, and a large I/O complement in an industrial-grade package. It is positioned for engineers and system designers who need substantial programmable resources and robust thermal and power characteristics for advanced interface, processing, and integration tasks.
Choosing this device provides access to the Stratix 10 family ecosystem and documentation, allowing designs that leverage family-level architectural innovations and hardened IP where applicable. It is suitable for projects that require a balance of performance, integration density, and industrial operating range.
Request a quote or submit an inquiry today to discuss availability, lead times, and volume pricing for the 1SG166HN3F43I2VG Stratix 10 GX FPGA.

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