1SG210HN1F43I2VG

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2100000 1760-BBGA, FCBGA

Quantity 1,011 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262500Number of Logic Elements/Cells2100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits133169152

Overview of 1SG210HN1F43I2VG – Stratix® 10 GX FPGA, 2,100,000 logic elements, 688 I/O, 1760-BBGA

The 1SG210HN1F43I2VG is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760‑BBGA (42.5 mm × 42.5 mm) FCBGA package. It delivers high logic and memory capacity with 2,100,000 logic elements and 133,169,152 total RAM bits, together with 688 user I/O pins for complex, high‑bandwidth designs.

As a Stratix 10 GX family device, this FPGA leverages the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) process technology to address demanding applications that require increased processing performance and power efficiency. The device is rated for industrial operation and supports a wide operating voltage and temperature range for robust deployment.

Key Features

  • Core Architecture  Intel Hyperflex™ core architecture delivering improved core performance as described in the Stratix 10 GX family overview.
  • Logic Capacity  2,100,000 logic elements to implement large-scale digital logic and custom accelerators.
  • On‑chip Memory  133,169,152 total RAM bits with family support for M20K internal SRAM memory blocks for flexible buffering and storage.
  • High‑Speed Interfaces  Device family features heterogeneous 3D SiP transceiver tiles, support for up to 96 transceiver channels, and transceiver data rates cited up to 28.3 Gbps for high‑bandwidth serial links.
  • Hard IP Blocks  Family-level hard IP includes PCI Express Gen3 x16 and 10G Ethernet hard IPs for integration of standard high‑speed protocols.
  • DSP and Compute  Variable precision DSP blocks and family-level compute capabilities designed for data‑intensive signal processing workloads.
  • Memory Controllers  Hard memory controllers and PHY supporting DDR4 rates (family specification up to 2666 Mbps per pin) for high‑performance external memory interfaces.
  • Power and Voltage  Core voltage supply range 770 mV to 970 mV to support optimized power delivery and management.
  • Package and Mounting  1760‑BBGA FCBGA package (1760‑FBGA, 42.5 × 42.5 mm) with surface‑mount construction for compact board integration.
  • Temperature and Grade  Industrial grade with operating temperature range −40 °C to 100 °C for deployment in demanding environments.
  • Compliance  RoHS compliant.

Typical Applications

  • High‑Performance Networking  Leverage high I/O count, 10G/40G hard IP and high‑speed transceivers for packet processing, switching and line‑card implementations.
  • Data Center Acceleration  Deploy large logic capacity, abundant on‑chip memory and DSP resources for hardware acceleration of compute and storage workloads.
  • Telecommunications Infrastructure  Use high transceiver bandwidth and protocol hard IP for backplane and optical transport systems requiring deterministic performance.
  • Test & Measurement  Exploit extensive I/O, on‑chip memory and DSP blocks for high‑throughput acquisition, signal processing and real‑time analysis.

Unique Advantages

  • Extensive Logic Scalability: 2,100,000 logic elements enable complex custom logic, large state machines and multiple concurrent accelerators on a single device.
  • Large On‑Chip Memory: 133,169,152 total RAM bits support deep buffering, FIFOs and memory‑intensive algorithms without immediate reliance on external DRAM.
  • Broad High‑Speed I/O: 688 user I/O pins and family transceiver capabilities accommodate diverse high‑bandwidth interfaces and system integration needs.
  • Industrial Robustness: Industrial temperature rating (−40 °C to 100 °C) and surface‑mount FCBGA packaging support deployment in demanding operational environments.
  • System Integration: Family hard IP for PCIe and Ethernet plus DDR4 memory controller support reduce design effort and speed time to market for standard interfaces.
  • Power‑Aware Operation: Supported core voltage range (770 mV–970 mV) and FinFET process family attributes enable power management options for optimized system power.

Why Choose 1SG210HN1F43I2VG?

The 1SG210HN1F43I2VG brings together high logic density, substantial on‑chip memory and a large complement of I/O in a single industrial‑grade Stratix 10 GX FPGA package. It is positioned for designs that require significant programmable logic, high‑speed serial connectivity and robust environmental operation.

This device is suitable for engineering teams building high‑bandwidth networking equipment, data‑center accelerators, telecom infrastructure and advanced test systems that benefit from Stratix 10 GX family architectural features and integration of high‑performance hard IP blocks.

Request a quote or submit a sales inquiry to discuss availability, pricing and lead times for 1SG210HN1F43I2VG. Our team can provide technical details, volume pricing and support for your design evaluation and procurement needs.

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