1SG210HN2F43I2VGAS

The 1SG210HN2F43I2VGAS is an Intel Stratix® 10 GX FPGA in a 1760-BBGA (FCBGA) package designed for high-density, high-performance digital designs. It combines Intel Stratix 10 family innovations—including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) process—with a large logic capacity, substantial on-chip RAM, and broad I/O to address advanced networking, compute acceleration, and signal processing applications.

Targeted at industrial-grade deployments, this device offers a wide operating temperature range and a compact 1760-FBGA (42.5 × 42.5 mm) footprint for surface-mount designs where processing density, memory bandwidth, and I/O richness are required.

Key Features

• Core Architecture  Built on the Intel Stratix 10 GX family with the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology for high-performance FPGA fabric.
• Logic Capacity  2,100,000 logic elements (LEs) to implement large custom logic, datapaths, and hardware accelerators.
• On‑Chip Memory  133,169,152 total RAM bits of embedded SRAM for buffering, lookup tables, and on-chip data storage.
• I/O and Package  688 user I/Os provided in a 1760-BBGA (FCBGA) package; supplier device package listed as 1760-FBGA (42.5 × 42.5 mm) for dense board-level integration.
• Transceiver and Interface IP (Family)  Stratix 10 GX family-level features include heterogeneous 3D SiP transceiver tiles and hard IP such as PCI Express Gen3 x16 and high-speed Ethernet and Interlaken PCS—enabling high-bandwidth link integration (family-level capability described in the product datasheet).
• DSP and Compute  Family-level variable precision DSP blocks and hard floating-point options are included in the Stratix 10 GX product family to support intensive signal processing workloads (see family datasheet for details).
• Power and Supply  Supported core supply range from 770 mV to 970 mV, enabling integration with modern low-voltage power delivery systems.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, suitable for industrial environments requiring extended temperature performance.
• Mounting and Compliance  Surface-mount device with RoHS compliance for lead-free assembly and regulatory alignment.

Typical Applications

• High-Speed Networking and Switching  Implement packet processing, Ethernet/Interlaken interfaces, and line-rate switching using the device’s high I/O count and family-level transceiver resources.
• Data Center Acceleration  Deploy hardware accelerators and custom datapaths for compute offload and low-latency processing leveraging the large logic capacity and on-chip RAM.
• High-Performance Signal Processing  Use embedded RAM and family DSP resources for real-time filtering, FFTs, and multi-channel signal chains in communications and radar systems.
• System Integration and Prototyping  Integrate complex system functions and prototype ASIC-bound logic with abundant LEs and I/O in a compact FCBGA footprint.

Unique Advantages

• High Logic Density: 2.1 million logic elements enable large-scale hardware designs and extensive parallelism within a single device.
• Substantial On‑Chip Memory: 133,169,152 RAM bits reduce reliance on external memory for many buffering and caching needs, simplifying board design.
• Rich I/O in a Compact Package: 688 I/Os in a 1760-FBGA (42.5 × 42.5 mm) package provide dense external connectivity while preserving a compact board footprint.
• Industrial Temperature Capability: −40°C to 100°C rating supports deployment in industrial environments with extended temperature ranges.
• Family-Level High-Speed Link Support: Stratix 10 GX family features such as heterogeneous 3D SiP transceiver tiles and hard protocol IP (as detailed in the family datasheet) enable integration of high-bandwidth serial links and industry-standard interfaces.
• Low-Voltage Core Operation: Core supply range (770 mV–970 mV) aligns with modern low-voltage power systems to help optimize thermal and power budgets.

Why Choose 1SG210HN2F43I2VGAS?

The 1SG210HN2F43I2VGAS pairs Stratix 10 GX family innovations with device-level scale—providing 2.1 million logic elements, large on-chip RAM, and hundreds of I/Os in a compact industrial-grade FCBGA package. This combination suits demanding designs that require high logic density, substantial embedded memory, and broad I/O connectivity without sacrificing operating temperature range.

Engineers designing high-speed networking, compute acceleration, and advanced signal processing systems will find this device offers the fabric capacity and family-level interface options described in the Intel Stratix 10 GX datasheet, enabling scalable implementations and integration into robust, production-grade products.

Request a quote or submit an inquiry to receive pricing and availability for 1SG210HN2F43I2VGAS and to discuss how this Stratix 10 GX device can fit your project requirements.