1SG210HN3F43I2VG

The 1SG210HN3F43I2VG is an Intel Stratix® 10 GX FPGA in a 1760‑BBGA FCBGA package, specified for industrial use. It delivers a large programmable fabric with 2,100,000 logic elements and substantial on‑chip RAM to address high‑performance designs that require extensive logic and memory resources.

Built on Stratix 10 family architecture, this device targets demanding applications that need high I/O density, significant on‑chip memory, and industrial temperature operation, while supporting low core supply voltages between 770 mV and 970 mV.

Key Features

• Core Architecture  Stratix 10 GX family architecture as documented in the device overview, designed for high core performance in demanding FPGA applications.
• Logic Capacity  2,100,000 logic elements provide a large programmable fabric for complex logic integration and system consolidation.
• On‑chip Memory  133,169,152 total RAM bits to support large buffering, packet processing, and in‑fabric data storage.
• I/O and Interfaces  688 user I/Os enable high channel counts and dense external connectivity for multi‑lane interfaces and complex board designs.
• Power and Voltage  Core supply range of 770 mV to 970 mV to match system power domains and optimize core power delivery.
• Package and Mounting  1760‑BBGA (FCBGA) supplier package (1760‑FBGA, 42.5 × 42.5 mm) designed for surface‑mount PCB assembly and high‑density board layouts.
• Operating Range and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in industrial environments.
• Surface Mount  Surface mount device format suitable for modern production and automated assembly processes.

Typical Applications

• High‑speed networking and packet processing  Use the large logic capacity and abundant I/O to implement multi‑lane packet engines, traffic management, and protocol processing.
• Data center acceleration and compute offload  Large on‑chip RAM and extensive logic resources allow implementation of custom acceleration kernels and data staging on the FPGA fabric.
• Advanced signal processing and DSP  On‑chip memory and high logic density support high‑throughput DSP pipelines and real‑time data processing tasks.
• Embedded SoC and system integration  Dense I/O and large programmable fabric enable integration of complex control, I/O aggregation, and custom hardware functions in a single package.

Unique Advantages

• Massive programmable fabric: 2,100,000 logic elements enable consolidation of large designs and reduce the need for multiple FPGAs.
• Large on‑chip RAM: 133,169,152 bits of RAM provide substantial local memory for buffering, packet staging, and high‑speed data paths.
• High I/O density: 688 I/Os support multi‑lane interfaces and extensive peripheral connectivity without external multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial environments with wide temperature swings.
• Compact, high‑density package: 1760‑BBGA (42.5 × 42.5 mm) allows high integration in space‑constrained systems while enabling automated surface‑mount assembly.
• Low nominal core voltage: 770–970 mV core supply aligns with modern low‑voltage power architectures for efficiency and power optimization.

Why Choose 1SG210HN3F43I2VG?

The 1SG210HN3F43I2VG positions itself as a high‑capacity Stratix 10 GX FPGA option for engineers who need large logic, abundant on‑chip memory, and extensive I/O in an industrial‑grade package. Its specification set is tailored for designs that require consolidation of complex functions, high data throughput, and reliable operation across a wide temperature range.

This device is well suited to system designers building networking, acceleration, and advanced signal‑processing platforms who require a dense FCBGA package, strict industrial operating limits, and a low core voltage operating envelope for power‑sensitive high‑performance designs.

Request a quote or contact sales to discuss pricing, availability, and how the 1SG210HN3F43I2VG can fit into your next high‑performance FPGA design.