1SG210HN3F43E2VG

The 1SG210HN3F43E2VG is an Intel Stratix® 10 GX family FPGA offering high logic density and extensive I/O in a 1760-ball BGA package. It combines Intel Hyperflex™ core architecture and 14 nm process family innovations (as described for the Stratix 10 series) with device-level resources tailored for bandwidth- and compute-intensive designs.

Typical use cases include high-speed networking, advanced signal processing, and complex FPGA-accelerated systems that require large on-chip memory, a high count of I/O, and a compact surface-mount package. The device is RoHS compliant and supplied in an extended-grade variant.

Key Features

• Core Architecture  Intel Stratix 10 family innovations including the Intel Hyperflex™ core architecture (series-level feature) for increased core performance compared to previous-generation high-performance FPGAs.
• Logic Capacity  2,100,000 logic elements (logic cells) to support large, complex designs and extensive parallel processing.
• On-Chip Memory  133,169,152 total RAM bits for buffering, packet processing, and large-data algorithms.
• I/O Resources  688 I/O pins to enable dense external connectivity and multiple high-speed interfaces.
• Transceiver and Series-Level Capabilities  Stratix 10 GX series documentation highlights high-speed transceiver support and hardened interfaces (series-level features such as PCI Express and 10G/40G Ethernet IP in the family).
• Package and Mounting  1760-ball BGA (FCBGA) surface-mount package; supplier device package specified as 1760-FBGA (42.5 × 42.5 mm).
• Power and Supply  Core voltage supply range from 770 mV to 970 mV for the device core rails.
• Temperature and Grade  Extended grade with operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑Speed Networking and Telecom  Use the device’s large logic capacity and family-level transceiver features to implement packet processing, switching, and line-rate protocol handling.
• Data Center Acceleration  Implement FPGA-based accelerators and PCI Express interface logic (family-level hard IP available in the series) for compute offload and I/O intensive workloads.
• Advanced Signal Processing  Leverage 2.1M logic elements and 133 Mb of on-chip RAM to build complex DSP pipelines, filters, and real-time processing chains.
• High‑Density I/O Systems  688 I/O pins enable dense external connectivity for multi-channel data acquisition, aggregation, or interface bridging.

Unique Advantages

• High Logic Density: 2,100,000 logic elements provide the capacity needed for large FPGA designs and extensive parallelism.
• Substantial On‑Chip Memory: 133,169,152 bits of RAM reduce reliance on external memory for buffering and accelerate on-chip data processing.
• Extensive External Connectivity: 688 I/O pins support multiple high-speed interfaces and complex system interconnects without additional I/O expanders.
• Compact, Surface‑Mount Package: 1760-ball FCBGA (42.5 × 42.5 mm) balances high pin count with a compact board footprint for system-level integration.
• Series-Level High-Speed IP: Stratix 10 GX family offers hardened IP for high-performance interfaces and transceivers (as documented for the series), simplifying implementation of common protocols.
• Extended Operating Range: Extended-grade device with a 0 °C to 100 °C operating range for applications requiring above-room-temperature operation.

Why Choose 1SG210HN3F43E2VG?

The 1SG210HN3F43E2VG is positioned for designs that demand a combination of high logic capacity, significant on-chip memory, and broad I/O in a single surface-mount package. It is suited to systems where dense integration and substantial FPGA fabric resources are required to implement complex data-paths, high-throughput interfaces, and advanced signal-processing algorithms.

As part of the Stratix 10 GX family, this device benefits from series-level innovations such as the Intel Hyperflex core architecture and advanced transceiver/hard IP capabilities, providing a scalable path within the family for projects that may grow in complexity or throughput requirements.

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