1SG210HN2F43E2VGAS

The Intel Stratix® 10 GX Field Programmable Gate Array (part 1SG210HN2F43E2VGAS) is a high-capacity FPGA IC designed for advanced, compute- and bandwidth-intensive designs. Built on the Stratix 10 GX family architecture, this device combines a large programmable fabric with extensive on-chip memory and high I/O density to address demanding applications in networking, data acceleration, and high-performance signal processing.

This extended-grade device delivers 2,100,000 logic elements, 133,169,152 total RAM bits, and 688 I/O in a 1760-BBGA FCBGA package, offering a compact, high-density solution for designs that require substantial logic, memory, and I/O resources within a controlled-temperature range.

Key Features

• Core architecture  Intel Stratix 10 GX family architecture (Hyperflex core architecture is part of the Stratix 10 GX family) providing a basis for high-performance programmable logic.
• Programmable logic capacity  2,100,000 logic elements available for implementing complex digital systems and large-scale custom logic.
• On-chip memory  133,169,152 total RAM bits to support buffering, large state machines, and memory-intensive algorithms.
• I/O density  688 I/O pins to support wide external interfacing, multiple parallel buses, and high-connectivity system designs.
• Power supply range  Operates from 770 mV to 970 mV, enabling integration into low-voltage core power domains.
• Package and mounting  1760-BBGA FCBGA package (supplier device package: 1760-FBGA, 42.5 × 42.5 mm) with surface-mount attachment for compact board-level integration.
• Operating conditions  Extended grade with an operating temperature range of 0 °C to 100 °C and RoHS compliance for regulatory alignment.

Typical Applications

• High-performance networking  Use the device’s large logic capacity and high I/O count to implement packet processing, switch/router functions, and protocol acceleration in networking equipment.
• Data center acceleration  Deploy the FPGA as a hardware accelerator for compute-intensive workloads that benefit from large programmable fabric and on-chip memory.
• Telecommunications infrastructure  Implement physical-layer and MAC-layer processing where extensive logic and RAM are required for line-rate processing and buffering.
• High-end signal processing  Support demanding DSP pipelines and large state machines using the device’s memory and logic resources for real-time processing tasks.

Unique Advantages

• High logic and memory capacity: 2,100,000 logic elements and 133,169,152 RAM bits provide headroom for large, complex designs without immediate partitioning across devices.
• Extensive connectivity: 688 I/O pins enable broad external interfacing and high-bandwidth parallel connections to peripherals and front-end modules.
• Compact, industry-standard package: 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) offers a dense footprint for board-level designs where space and routing density matter.
• Extended-grade operation: Rated for 0 °C to 100 °C to meet the thermal requirements of many commercial and enterprise environments.
• Regulatory readiness: RoHS-compliant to simplify environmental compliance in assembled systems.
• Low-voltage core compatibility: 770 mV to 970 mV supply range supports integration with contemporary low-voltage power architectures.

Why Choose 1SG210HN2F43E2VGAS?

The 1SG210HN2F43E2VGAS combines substantial programmable logic, abundant on-chip memory, and high I/O density in a single extended-grade Stratix 10 GX FPGA package. It is positioned for engineers who need a scalable, high-capacity FPGA platform for demanding networking, acceleration, and signal-processing designs where large logic and memory resources are essential.

With a compact 1760-BBGA package, RoHS compliance, and a defined operating voltage and temperature window, this device supports robust system integration and predictable deployment for commercial and enterprise applications that require significant programmable resources.

Request a quote or submit an inquiry to get pricing and availability for the 1SG210HN2F43E2VGAS and to discuss how it fits your next high-capacity FPGA design.