1SG210HN1F43E2VG

The 1SG210HN1F43E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) designed for advanced, high-performance applications. Built on the Stratix 10 family innovations and Intel Hyperflex core architecture, this device targets designs that require high logic density, large on-chip RAM, and a high I/O count.

This FPGA combines 2,100,000 logic elements with 133,169,152 bits of internal RAM, operates from a low-voltage core rail, and ships in a high-pin-count 1760-BBGA (FCBGA) package—making it suitable for systems demanding significant compute and interface resources within a surface-mount board design.

Key Features

• Core Architecture  Intel Hyperflex core architecture (Stratix 10 family) delivering increased core performance and power efficiency compared to previous-generation high-performance FPGAs.
• Logic Capacity  2,100,000 logic elements to implement large-scale programmable logic and complex algorithms.
• On-Chip Memory  133,169,152 total RAM bits for buffering, lookup tables, and on-device data storage.
• I/O and Package  688 I/O pins in a 1760-BBGA, FCBGA package; supplier device package listed as 1760-FBGA (42.5×42.5). Surface-mount mounting type for PCB assembly.
• Power Supply  Core voltage range specified at 770 mV to 970 mV to support optimized power delivery.
• Thermal and Grade  Extended grade device with an operating temperature range of 0°C to 100°C.
• Family-Level Connectivity and Performance  Stratix 10 family documentation highlights heterogeneous 3D SiP transceiver tiles and high-speed transceiver capabilities for demanding bandwidth applications (family-level feature).
• Compliance  RoHS compliant.

Typical Applications

• High-Bandwidth Networking  Implements packet processing, protocol offload, and high-density interface logic where large logic capacity and many I/Os are required.
• Data Center Acceleration  Accelerates compute tasks and custom data-paths using abundant logic and substantial on-chip RAM for buffering and staging data.
• Telecommunications & Backplane Systems  Supports complex interface logic and multi-gigabit transceiver tiles (family-level) for backplane and module-to-module links.
• Signal Processing & DSP  Hosts large-scale algorithms and filtering functions that leverage extensive logic elements and embedded RAM.

Unique Advantages

• High Logic Density: 2,100,000 logic elements provide the capacity to integrate large custom hardware functions on a single device.
• Substantial On-Chip Memory: 133,169,152 bits of RAM reduce external memory dependency for many buffering and state-machine needs.
• Large I/O Count: 688 I/Os allow broad interfacing without extensive external multiplexing, simplifying board design for dense systems.
• Low-Voltage Operation: 770 mV–970 mV core supply range supports modern power-optimized system architectures.
• Extended Operating Range: 0°C to 100°C grade accommodates a wide set of commercial and extended-environment deployments.
• High-Pin-Count FCBGA Package: 1760-BBGA (1760-FBGA supplier package) enables dense signal routing and high I/O integration in a surface-mount form factor.

Why Choose 1SG210HN1F43E2VG?

The 1SG210HN1F43E2VG delivers a combination of high logic capacity, significant on-chip RAM, and a large I/O complement in a single Stratix 10 GX FPGA part. It is positioned for engineers developing advanced systems that require substantial programmable logic and memory resources alongside robust interfacing options.

As part of the Stratix 10 family and built on Intel Hyperflex architecture, this device offers architectural advantages aimed at improved performance and power efficiency for demanding applications—providing a scalable, high-capacity platform for complex FPGA-based designs.

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