1SG166HN3F43I3XG

The 1SG166HN3F43I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) IC delivering high logic density and extensive I/O in a 1760-BBGA surface-mount package. Built on the Stratix 10 family architecture, the device leverages the Intel Hyperflex core and advanced device innovations to address advanced, high-bandwidth processing applications.

Designed for industrial-grade applications, this device combines 1,660,000 logic elements, large on-chip RAM, and broad I/O to support complex packet processing, acceleration, and system-level integration while operating across a wide temperature and core-voltage range.

Key Features

• Core & architecture  Intel Hyperflex core architecture as presented in the Stratix 10 GX family, delivering increased core performance and efficiency relative to previous-generation high-performance FPGAs.
• Logic capacity  1,660,000 logic elements for implementing large, compute-dense designs.
• On-chip memory  125,829,120 total RAM bits available for buffering, LUTRAM, and embedded memory structures.
• I/O and package  688 I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) surface-mount configuration for high-density board integration.
• Transceiver & connectivity (family-level)  Stratix 10 GX family features heterogeneous 3D SiP transceiver tiles and high-speed transceiver capability as described in the device overview.
• Power and supply  Core voltage supply range 820 mV to 880 mV for the device core domain.
• Thermal & environmental  Industrial operating temperature range −40 °C to 100 °C and RoHS compliant.

Typical Applications

• High-speed networking and switching  Use the device’s large logic capacity and extensive I/O to implement packet processing, switching fabrics, and protocol offload engines.
• Data center acceleration  Implement custom accelerators and data-paths that require wide internal memory and dense logic resources.
• Telecommunications and backplane interfaces  Leverage family-level high-speed transceiver capabilities and abundant I/O for backplane, fronthaul, and aggregation applications.
• Compute and signal processing  Deploy for variable-precision DSP and compute-intensive workloads benefiting from the Stratix 10 architecture.

Unique Advantages

• High logic density: 1,660,000 logic elements enable large-scale integration of logic, control, and datapath functions on a single device.
• Significant on-chip RAM: 125,829,120 total RAM bits provide substantial local storage for buffering, state, and memory-intensive algorithms.
• Extensive I/O in a compact BGA: 688 I/Os in a 1760-BBGA package support high pin-count system designs while maintaining a compact board footprint.
• Industrial temperature tolerance: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Conservative core-voltage window: 820 mV to 880 mV supply range for the core power domain supports controlled power delivery and thermal planning.
• Stratix 10 family technologies: Built on the Stratix 10 GX family innovations (including Hyperflex core and advanced transceiver options) for high-performance system designs.

Why Choose 1SG166HN3F43I3XG?

The 1SG166HN3F43I3XG positions itself as a high-density, industrial-grade Stratix 10 GX FPGA suitable for engineers implementing complex, bandwidth-heavy systems. Its combination of 1,660,000 logic elements, substantial on-chip RAM, and 688 I/Os in a 1760-BBGA package provides the integration needed to reduce board-level complexity while maintaining flexibility through FPGA programmability.

Backed by the Stratix 10 device family architecture, this device is aimed at designs that require significant compute and memory resources, robust thermal margins, and deployment in industrial temperature environments. It offers a clear path for scaling designs that leverage Intel Stratix 10 family capabilities.

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