1SG210HN3F43I3VG
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2100000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 252 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 262500 | Number of Logic Elements/Cells | 2100000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 133169152 |
Overview of 1SG210HN3F43I3VG – Stratix® 10 GX FPGA, 2,100,000 Logic Elements, 688 I/O, 1760-BBGA
The 1SG210HN3F43I3VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-ball FCBGA package. Built on the Stratix 10 family architecture, it combines a high-density programmable fabric with advanced transceiver and memory resources for demanding, high‑performance applications.
Designed for industrial-grade deployments, this device targets systems that require large logic capacity, substantial on-chip RAM, and extensive I/O connectivity while operating across a wide temperature range and a low-voltage core supply.
Key Features
- High-density programmable core — 2,100,000 logic elements provide extensive logic capacity for complex custom processing and large-scale FPGA implementations.
- Advanced core architecture — Intel Hyperflex core architecture (Stratix 10 family) is implemented to deliver increased core performance for compute‑intensive designs.
- On-chip memory — 133,169,152 total RAM bits to support large buffering, packet processing, and data staging directly within the FPGA fabric.
- Extensive I/O — 688 I/O pins allow broad external connectivity for high pin‑count systems and multi‑lane interfaces.
- High‑speed serial capability (family-level) — Stratix 10 family transceivers support high data rates and backplane/chip‑to‑chip links as described in the device overview.
- Power and supply — Core voltage supply range from 770 mV to 970 mV to match modern low-voltage FPGA power domains.
- Industrial grade and operating range — Rated for industrial operation with a specified temperature range of −40 °C to 100 °C.
- Package — 1760-ball BGA (1760-FBGA, 42.5 × 42.5 mm) for high I/O density and thermal/mechanical stability in board designs.
- Standards and compliance — RoHS compliant.
Typical Applications
- High‑performance networking and telecommunications — Large logic capacity and family-level high-speed transceiver technology support packet processing, switching, and backplane interconnects.
- Data center acceleration — Substantial on-chip RAM and dense logic enable custom acceleration functions and protocol offloads within FPGA-based accelerators.
- Test and measurement — High I/O count and configurable fabric suit complex signal aggregation, protocol analysis, and real‑time processing tasks.
- Industrial compute and control — Industrial temperature grade and broad voltage support make the device suitable for embedded control, data acquisition, and deterministic processing roles.
Unique Advantages
- Large programmable capacity: 2,100,000 logic elements provide headroom for extensive custom logic, algorithm partitioning, and multi‑function designs.
- Substantial on‑chip memory: 133,169,152 RAM bits reduce dependence on external memory for buffering and stateful processing, simplifying board design.
- High I/O density: 688 I/O pins in a single device allow direct connections to numerous peripherals, multi‑lane interfaces, and parallel buses.
- Industrial robustness: −40 °C to 100 °C operating range and industry-standard BGA packaging support deployment in rugged and controlled environments.
- Family-level architecture benefits: Stratix 10 family innovations such as the Hyperflex core and high‑rate transceivers provide architectural advantages for performance and bandwidth.
- Compliance and manufacturability: RoHS compliance and a standard 1760-FBGA footprint aid regulatory and manufacturing workflows.
Why Choose 1SG210HN3F43I3VG?
This Stratix 10 GX device positions itself for designs that demand large programmable logic capacity, significant on‑chip memory, and extensive I/O. Its industrial temperature rating and modern package make it suitable for systems requiring reliable operation across a wide thermal range.
Choose the 1SG210HN3F43I3VG when your project requires a high‑density FPGA fabric combined with family-proven architecture enhancements that target performance and bandwidth‑intensive applications, backed by documented device specifications and compliance attributes.
Request a quote or submit a pricing inquiry to evaluate 1SG210HN3F43I3VG for your next high‑performance FPGA design.

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