1SG210HU2F50E2VG

The 1SG210HU2F50E2VG is an Intel Stratix 10 GX FPGA in a 2397-BBGA (FCBGA) surface-mount package. It provides a high-density programmable fabric with 2,100,000 logic elements, large on-chip RAM, and 704 I/O pins for complex, high-bandwidth designs.

Built on the Stratix 10 GX family architecture, the device incorporates family-level innovations such as the Intel Hyperflex core architecture and high-performance transceiver/PHY features to address demanding networking, compute acceleration, and communications applications while operating within a 770 mV to 970 mV core voltage range.

Key Features

• Core Architecture  Based on the Intel Stratix 10 GX family and Intel Hyperflex core architecture, delivering family-level improvements in core performance and scalability.
• Logic Capacity  2,100,000 logic elements available for implementing large-scale digital logic and custom compute pipelines.
• On-Chip Memory  133,169,152 total RAM bits of embedded memory to support buffering, packet processing, and large on-chip data structures.
• I/O and Package  704 I/O pins in a 2397-BBGA (FCBGA, 50×50) supplier device package with surface-mount mounting for dense system integration.
• Power and Operating Range  Core voltage supply range of 770 mV to 970 mV and an operating temperature range of 0°C to 100°C; device grade listed as Extended.
• Family High-Speed and IP Features  Stratix 10 GX family features include heterogeneous transceiver tiles, fractional-synthesis PLLs, hard PCIe and Ethernet IP, and variable-precision DSP blocks as described for the device family.
• Compliance  RoHS compliant.

Typical Applications

• High-Speed Networking  Use the device’s large logic capacity, substantial on-chip RAM, and high I/O count for packet processing, switching, and protocol offload functions.
• Data Center Acceleration  Implement compute offload, custom accelerators, and data-path pipelines leveraging 2,100,000 logic elements and family-level DSP capabilities.
• Telecommunications Infrastructure  Deploy the FPGA in systems that require flexible PHY, protocol processing, and large buffering using the device’s memory and I/O resources.
• High-Performance Embedded Systems  Integrate complex control, signal processing, and interface logic where high logic density and extensive I/O are required.

Unique Advantages

• High Logic Density: 2,100,000 logic elements enable implementation of large, integrated designs without fragmenting functionality across multiple devices.
• Large On-Chip Memory: 133,169,152 total RAM bits support deep buffering and data-centric workloads directly on the FPGA fabric.
• Extensive I/O Count: 704 I/Os provide flexible interface options for complex board-level connectivity and multi-protocol designs.
• Family-Level Performance Features: Stratix 10 GX family innovations—such as Hyperflex architecture, high-performance transceiver and DSP blocks—offer advanced building blocks for demanding applications.
• Compact Surface-Mount Package: 2397-BBGA (FCBGA) packaging supports dense PCB integration while maintaining a large logic and I/O footprint.
• Extended Operating Range: Extended grade with 0°C to 100°C operation suits a wide set of system environments.

Why Choose 1SG210HU2F50E2VG?

The 1SG210HU2F50E2VG positions itself as a high-capacity Stratix 10 GX FPGA option for designers who need significant on-chip logic, memory, and I/O resources in a single surface-mount package. Its combination of 2,100,000 logic elements, 133,169,152 RAM bits, and 704 I/Os makes it suitable for large-scale, high-bandwidth designs that rely on extensive programmable fabric.

Because it is part of the Stratix 10 GX family, the device benefits from architecture-level innovations documented for the family—enabling implementation of complex protocol stacks, data-path accelerators, and high-performance signal-processing blocks while operating within defined voltage and temperature specifications.

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