1SG210HU3F50E3VG

The 1SG210HU3F50E3VG is a Stratix® 10 GX field programmable gate array offered in a 2397-BBGA FCBGA package. It delivers a large programmable fabric combined with high I/O density and is targeted at designs that require significant logic capacity, embedded memory, and advanced I/O connectivity.

As part of the Stratix® 10 family, this device benefits from the series’ architectural innovations—including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology—addressing high-bandwidth, high-performance applications while enabling advanced system integration.

Key Features

• Logic Capacity  2,100,000 logic elements (stated logic element cells) for large-scale FPGA designs and complex hardware functions.
• On-chip Memory  133,169,152 total RAM bits to support large buffering, data staging, and embedded memory structures.
• I/O Density  704 I/O pins to support extensive external device connectivity and high-pin-count interfaces.
• Package & Mounting  2397-BBGA, FCBGA package (supplier device package: 2397-FBGA, FC 50×50); surface-mount device for PCB assembly.
• Power Supply Range  Core voltage supply from 770 mV to 970 mV, allowing designers to target the device’s specified operating voltages.
• Operating Temperature & Grade  Extended grade with an operating range of 0 °C to 100 °C.
• Stratix® 10 Family Innovations  Features documented series-level technologies such as the Intel Hyperflex core architecture, Intel 14 nm tri-gate technology, heterogeneous 3D SiP transceiver tiles, and advanced PLL and transceiver capabilities described in the device overview.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• High‑performance Networking  Large logic capacity and high I/O count enable switching, packet processing, and protocol bridging functions in networking equipment.
• Data Center Acceleration  Substantial on-chip RAM and logic resources support custom accelerators, data buffering, and inline processing tasks.
• Telecommunications Infrastructure  High I/O density and Stratix® 10 family transceiver and PLL innovations (as documented in the family overview) support demanding backplane and module-level communication functions.
• Advanced DSP and Signal Processing  Large logic and memory resources are suitable for fixed- and floating-point DSP pipelines and variable-precision workloads referenced in the family overview.

Unique Advantages

• High Logic Density: 2,100,000 logic elements provide ample capacity for complex, multi‑function designs and hardware acceleration.
• Large Embedded Memory: 133,169,152 total RAM bits reduce dependence on external memory for many buffering and intermediate-data needs.
• Extensive I/O: 704 I/O pins enable broad peripheral and interface support without additional multiplexing hardware.
• Family-Level Architectural Innovations: The Stratix® 10 family’s Hyperflex core architecture and 14 nm tri-gate process (as documented) contribute to the device’s performance and integration potential.
• Compact Surface‑Mount Packaging: 2397‑BBGA FCBGA in a 50×50 supplier package footprint supports high-density board layouts.
• Designed for Extended‑Temperature Use: Rated 0 °C to 100 °C to suit applications that require an extended commercial temperature range.

Why Choose 1SG210HU3F50E3VG?

The 1SG210HU3F50E3VG positions itself as a high‑capacity Stratix® 10 GX FPGA option for system designers who need substantial logic resources, large on‑chip memory, and significant I/O bandwidth in a compact FCBGA package. Its specification set—2.1M logic elements, 133M bits of RAM, and 704 I/Os—matches demanding compute, networking, and signal processing roles where integration and fabric capacity matter.

Choosing this device means leveraging the Stratix® 10 family innovations described in the device overview (Hyperflex core architecture, 14 nm tri‑gate process, and heterogeneous packaging/transceiver technologies) while maintaining compliance with RoHS and meeting extended-grade operating requirements. It is suitable for teams building scalable, high-performance FPGA-based systems that require verified silicon characteristics and documented family-level features.

Request a quote or submit an inquiry to receive pricing, lead time, and availability information for the 1SG210HU3F50E3VG.