1SG211HN1F43E2LG

The 1SG211HN1F43E2LG is an Intel Stratix® 10 GX field programmable gate array supplied in a 1760-BBGA FCBGA package. Built on the Stratix 10 family architecture, the device combines a large logic fabric with substantial on-chip RAM and broad I/O capability for high-performance digital processing and connectivity applications.

This device targets applications that require high logic density, significant embedded memory, and extensive I/O, and benefits from Stratix 10 family innovations such as the Intel Hyperflex core architecture and Intel 14 nm FinFET technology described in the device overview.

Key Features

• Logic Capacity — 2,110,000 logic elements, providing substantial programmable logic resources for complex designs.
• Embedded Memory — 140,509,184 total RAM bits to support large buffers, packet processing, or on-chip data staging.
• I/O Density — 688 user I/Os to accommodate wide external interfaces and high channel counts.
• Package and Mounting — 1760-BBGA (FCBGA) package, supplier device package 1760-FBGA (42.5 × 42.5 mm); surface-mount for standard PCB assembly.
• Power and Supply — Core supply operating range of 820 mV to 880 mV to match Stratix 10 power architecture requirements.
• Thermal and Grade — Extended grade with operating temperature range of 0 °C to 100 °C, and RoHS compliant.
• Stratix 10 Family Innovations — Leverages the Stratix 10 family architecture described in the device overview, including the Intel Hyperflex core architecture and heterogeneous 3D SiP transceiver tile concepts.

Typical Applications

• High‑performance Networking — Large logic and on‑chip RAM combined with high I/O counts enable packet processing, switching, and protocol offload functions.
• Data Center Acceleration — Dense programmable logic and memory resources support custom acceleration engines and data-path buffering.
• Telecommunications and Backplane Systems — Extended-grade operation and high I/O enable use in telecom line cards, aggregation, and backplane interface roles.
• Test & Measurement Equipment — Extensive I/O and large internal RAM make the device suitable for instrumentation that requires flexible, high‑density logic and data capture.

Unique Advantages

• High Logic Density: 2,110,000 logic elements allow implementation of large, complex FPGA designs without external logic expansions.
• Substantial On‑Chip Memory: 140,509,184 RAM bits reduce dependency on external memory for many buffering and data‑processing tasks, simplifying board design.
• Broad I/O Support: 688 I/Os enable extensive connectivity for multi-channel interfaces, protocol bridging, and wide data paths.
• Compact, Assembly‑Ready Package: 1760-FBGA (42.5 × 42.5 mm) in a surface-mount BBGA footprint supports high‑density PCB integration.
• Power Architecture Compatibility: Core voltage range 820 mV–880 mV aligns with Stratix 10 family core supply requirements for optimized power distribution.
• Extended‑Grade Operation: Rated for 0 °C to 100 °C and RoHS compliant for use in applications requiring extended temperature range adherence.

Why Choose 1SG211HN1F43E2LG?

The 1SG211HN1F43E2LG positions itself as a high‑capacity Stratix 10 GX FPGA option for designs that demand a combination of large programmable logic, extensive embedded RAM, and high I/O density. Its mechanical and electrical specifications — including the 1760‑BBGA package, surface-mount compatibility, core supply window, and extended operating temperature — make it suitable for demanding communications, data center, and test system roles.

As part of the Stratix 10 family, this device benefits from the architectural innovations documented for the series, providing a scalable platform for complex, high‑performance FPGA implementations while retaining a clear set of verifiable device specifications for system integration and procurement.

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