1SG210HU3F50I2VG

The 1SG210HU3F50I2VG is a Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package, designed for high-density, high-throughput designs. It combines a large logic fabric—2,100,000 logic elements—with abundant on-chip memory and I/O to address demanding compute and connectivity tasks.

Targeted at advanced networking, compute acceleration and signal-processing applications, this device delivers series-level innovations including the Intel Hyperflex core architecture and 14 nm tri-gate process technology while offering industrial-grade temperature and voltage operating ranges for robust deployment.

Key Features

• Logic Capacity  2,100,000 logic elements enable complex programmable logic implementations and large-scale custom hardware functions.
• Embedded Memory  133,169,152 total RAM bits provide substantial on-chip storage for buffering, lookup tables and intermediate data without relying solely on external memory.
• I/O Density  704 user I/O pins accommodate wide parallel interfaces, multi-lane signalling and diverse peripheral connections.
• Power and Voltage  Supported core voltage range of 770 mV to 970 mV allows operation within defined low-voltage system power domains.
• Package and Mounting  2397-BBGA (FCBGA) package in a 50 × 50 mm supplier device package footprint, designed for surface-mount assembly in high-pin-count systems.
• Operating Temperature  Industrial-grade range from −40 °C to 100 °C for reliable performance across temperature extremes.
• Series-Level Architecture  Built on the Stratix® 10 GX family innovations, including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology.

Typical Applications

• High-bandwidth networking  Implement packet processing, protocol offload and multi-lane interface logic using the device’s large logic fabric and high I/O count.
• Data center acceleration  Deploy custom acceleration pipelines and inline data processing where large logic capacity and on-chip memory reduce external memory dependencies.
• Advanced signal processing  Build real-time DSP and filtering engines that leverage the extensive logic and embedded RAM for buffering and algorithm implementation.
• Test, measurement and instrumentation  Use the device’s I/O density and robust temperature range for high-channel-count acquisition and processing systems.

Unique Advantages

• High logic density:  2,100,000 logic elements enable consolidation of large designs into a single device, reducing system complexity.
• Substantial on-chip memory:  133,169,152 RAM bits provide ample internal storage for state machines, FIFOs and data buffering, improving performance and latency.
• Extensive I/O availability:  704 I/O pins support wide parallel interfaces and mixed-signal front ends without external multiplexing.
• Industrial temperature operation:  Rated from −40 °C to 100 °C for deployment in environments with wide thermal variation.
• Designed for high-pin-count systems:  The 2397-BBGA FCBGA package enables dense routing and high aggregate bandwidth in modern PCBs.
• Series-level innovation:  Leverages the Stratix® 10 GX family architecture and 14 nm tri-gate process advancements for improved core performance and efficiency.

Why Choose 1SG210HU3F50I2VG?

This Stratix® 10 GX device is positioned for engineers who need a high-capacity FPGA with abundant on-chip memory and I/O to implement large, performance-sensitive designs. Its combination of 2.1 million logic elements, extensive RAM, and a high I/O count makes it suitable for consolidating complex functions into a single programmable device, reducing board-level complexity.

With an industrial temperature rating and compact 2397-BBGA package, the 1SG210HU3F50I2VG offers a balance of capacity, integration and deployment readiness for advanced communications, acceleration and signal-processing systems backed by the Stratix® 10 series architecture.

Request a quote or submit an inquiry to receive pricing and availability details for 1SG210HU3F50I2VG and to discuss how this FPGA can fit into your next high-performance design.