1SG210HU3F50E2VG

The 1SG210HU3F50E2VG is an Intel Stratix® 10 GX high-performance FPGA in a 2397-ball FCBGA package intended for surface-mount PCB assembly. It combines a large programmable fabric with abundant I/O and on-chip RAM to address demanding bandwidth and compute-oriented designs.

Built on the Stratix® 10 family architecture described in the device overview, this device is positioned for applications that require high logic capacity, extensive on-chip memory, and fast I/O while operating within an extended temperature range.

Key Features

• Logic Capacity  Provides 2,100,000 logic elements for implementing large-scale logic, control, and data-path functions in a single device.
• On-chip Memory  Includes 133,169,152 total RAM bits to support buffering, packet processing, and local data storage without external memory in many use cases.
• Programmable I/O  Offers 704 I/O pins to support wide parallel interfaces, multiple high-speed lanes, and diverse board-level connectivity.
• Package and Mounting  2397-BBGA (FCBGA) package, supplied as 2397-FBGA, FC (50×50), designed for surface-mount assembly to simplify board integration.
• Power Supply  Core supply operating range from 770 mV to 970 mV, enabling designers to plan power delivery and sequencing accordingly.
• Operating Range and Grade  Extended-grade device specified for operation from 0 °C to 100 °C.
• Compliance  RoHS compliant.
• Family-Level Innovations  Based on Stratix® 10 GX family architecture, which includes the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as described in the device overview.

Typical Applications

• Data Center Networking  Large logic capacity and abundant I/O enable packet processing, switch fabric control, and protocol acceleration.
• High-Performance Computing Acceleration  On-chip RAM and massive logic resources support custom accelerators and data-path offload engines.
• Telecom and Optical Systems  High I/O count and family-level transceiver capabilities (per device overview) make the device suitable for line cards and backplane interfaces.
• Embedded System Platforms  Integrates large programmable fabric and memory to implement complex control, preprocessing, and interface functions on a single chip.

Unique Advantages

• High Logic Density: 2,100,000 logic elements let you consolidate multi-chip designs into a single FPGA, reducing board complexity.
• Substantial On-Chip Memory: 133,169,152 bits of RAM provide significant local buffering and storage to minimize external memory dependency.
• Large I/O Resource Pool: 704 I/Os support wide parallel buses and numerous serial lanes without external multiplexing hardware.
• Surface-Mount FCBGA Packaging: 2397-ball FCBGA in a 50×50 footprint enables compact board layouts while supporting high pin counts.
• Extended Operating Range: Rated 0 °C to 100 °C to fit systems that operate above commercial-room temperatures.
• Standards-Conscious Manufacturing: RoHS compliance supports regulatory and sustainability goals in production.

Why Choose 1SG210HU3F50E2VG?

The 1SG210HU3F50E2VG pairs large-scale programmable logic with significant on-chip RAM and extensive I/O in a single FCBGA device, making it suitable for complex, compute- and bandwidth-intensive designs. Its specifications support designs where consolidating functionality and minimizing external components are priorities.

Engineers looking for a high-capacity Stratix® 10 GX FPGA with defined supply and temperature ranges will find this part appropriate for scalable designs that benefit from the Stratix® 10 family architecture.

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