1SG210HU1F50E2VGAS

IC FPGA 704 I/O 2397BGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2100000 2397-BBGA, FCBGA

Quantity 82 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package2397-FBGA, FC (50x50)GradeExtendedOperating Temperature0°C – 100°C
Package / Case2397-BBGA, FCBGANumber of I/O704Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs262500Number of Logic Elements/Cells2100000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits133169152

Overview of 1SG210HU1F50E2VGAS – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 I/O, 2,100,000 LEs, 2397-BBGA FCBGA

The 1SG210HU1F50E2VGAS is an Intel Stratix® 10 GX FPGA offered in a 2397‑ball FCBGA package. It provides high logic capacity and large on‑chip RAM for designs that require substantial programmable fabric and memory density.

Built around Stratix 10 family innovations, this device targets high‑performance applications that benefit from advanced core architecture, high‑speed I/O and transceiver options, and extensive embedded memory resources.

Key Features

  • Logic Capacity — 2,100,000 logic elements (LEs) to implement complex programmable logic and large-scale designs.
  • Embedded Memory — 133,169,152 total RAM bits of on‑chip RAM to support large buffers, lookup tables, and memory‑intensive algorithms.
  • I/O and Package — 704 I/O pins in a 2397‑BBGA (FCBGA) package (supplier package: 2397‑FBGA, 50×50 mm) for dense board integration and flexible interfacing.
  • Voltage and Thermal — Core supply range 770 mV to 970 mV and operating temperature range 0 °C to 100 °C; graded as Extended.
  • Family Innovations — Stratix 10 family features such as the Intel Hyperflex™ core architecture, Intel 14 nm tri‑gate (FinFET) process, and heterogeneous 3D SiP transceiver tiles are part of the device family design philosophy.
  • High‑Speed Transceiver and IP Options — Family‑level capabilities include multi‑Gbps transceivers, hard PCI Express and high‑speed Ethernet/IP blocks as documented for Stratix 10 GX/SX devices.
  • Reliability and Security — Family documentation references device security features and single event upset (SEU) detection and correction mechanisms for improved system reliability.
  • Compliance — RoHS compliant for lead‑free manufacturing and environmental compatibility.

Typical Applications

  • High‑Performance Networking — Packet processing, line cards and switches that require large programmable fabrics and high‑speed I/O to manage bandwidth and implement custom protocols.
  • Data Center Acceleration — FPGA‑based accelerators and PCIe‑attached compute cards leveraging dense logic and on‑chip memory for latency‑sensitive workloads.
  • Advanced Signal Processing — Wideband DSP, FFTs and custom signal chains that use the device’s large RAM and logic resources for real‑time processing.
  • Test & Measurement — High‑channel count measurement systems and instrumentation that need deterministic, high‑performance programmable logic and numerous I/O pins.

Unique Advantages

  • Large programmable fabric: 2,100,000 logic elements enable implementation of complex algorithms and deep pipelined designs on a single device.
  • Substantial on‑chip memory: Over 133 million bits of RAM reduce external memory dependence and improve data throughput for buffer‑intensive applications.
  • High I/O density in an FCBGA package: 704 I/O pins in a 2397‑ball FCBGA provide flexible board routing and support for multi‑lane interfaces.
  • Family-level high‑speed I/O and IP: Stratix 10 family capabilities such as multi‑Gbps transceivers and hard IP blocks enable integration of modern high‑bandwidth interfaces.
  • Designed for performance and efficiency: Family innovations including the Hyperflex core and 14 nm FinFET process contribute to improved core performance and power characteristics.
  • Extended grade and RoHS compliance: 0 °C to 100 °C operating range and RoHS compliance support deployment across a range of commercial and extended‑temperature applications.

Why Choose 1SG210HU1F50E2VGAS?

This Stratix 10 GX FPGA combines very high logic capacity, large embedded RAM, and a high pin‑count FCBGA package to address demanding designs that require on‑device processing, buffering, and extensive I/O. It is positioned for projects where scalable programmable fabric and family‑level high‑speed interface options are critical.

Design teams targeting networking, data center acceleration, advanced signal processing, or test systems will find the device’s mix of logic, memory, and I/O advantageous for consolidating functions onto a single FPGA and reducing system complexity.

Request a quote or submit an inquiry to purchase 1SG210HU1F50E2VGAS and discuss quantity, lead time, and pricing for your project requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up